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Journal Articles

Characterization of Process for Embedding SiC Fibers in Al 6061 O Matrix Through Ultrasonic Consolidation

Dezhi Li, Rupert C. Soar

J. Eng. Mater. Technol. April 2009, 131(2): 021016.

DOI: https://doi.org/10.1115/1.3030946

Published Online: March 9, 2009

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Topics: Fibers, Bond strength

Proceedings Papers

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Changqing Liu, David A. Hutt, Dezhi Li, Paul P. Conway

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1819-1825, July 17–22, 2005

Paper No: IPACK2005-73160

DOI: https://doi.org/10.1115/IPACK2005-73160

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Topics: Alloys, Lead-free solders, Nickel, Coatings, Tin, Storage, Temperature, Testing, Copper, Mechanical properties

Proceedings Papers

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 147-153, July 6–11, 2003

Paper No: IPACK2003-35130

DOI: https://doi.org/10.1115/IPACK2003-35130

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Topics: Flip-chip, Flip-chip devices, Solders, Manufacturing, Brittleness, Reliability, Shear (Mechanics), Shear strength, Testing, Tin

Journal Articles

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Dezhi Li, Changqing Liu, Paul P. Conway

J. Electron. Packag. March 2008, 130(1): 011005.

DOI: https://doi.org/10.1115/1.2837522

Published Online: January 31, 2008

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Topics: Flip-chip, Flip-chip devices, Reliability, Solder joints, Solders, Tin, Solder masks, Failure, Fracture (Materials), Cycles

Journal Articles

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen

J. Electron. Packag. September 2004, 126(3): 359–366.

DOI: https://doi.org/10.1115/1.1773391

Published Online: October 6, 2004

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Topics: Flip-chip, Nanoindentation, Shear (Mechanics), Solders, Tin, Flip-chip devices, Intermetallic compounds, Testing, Reliability, Shear strength

Journal citation

NARROW

Characterization of Process for Embedding SiC Fibers in Al 6061 O Matrix Through Ultrasonic Consolidation

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Characterization of Process for Embedding SiC Fibers in Al 6061 O Matrix Through Ultrasonic Consolidation

Effect of Microstructural Characteristics of Electroless Nickel Metallisation on Solderability to Pb-Free Solder Alloys

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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