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Douglas C. Hopkins
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Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Paper No: IPACK2017-74222
DOI: https://doi.org/10.1115/IPACK2017-74222
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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride
Proceedings Papers

Design Considerations of Packaging a High Voltage Current Switch

Ankan De, Adam Morgan, Subhashish Bhattacharya, Douglas C. Hopkins
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A014, July 6–9, 2015
Paper No: IPACK2015-48714
DOI: https://doi.org/10.1115/IPACK2015-48714
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Topics: Design, Packaging, Switches, Anodes, Computer software, Current density, Electromagnetic fields, Gates (Closures), Packing (Shipments), Packings (Cushioning)
Proceedings Papers

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Mohd F. Abdulhamid, Cemal Basaran, Douglas C. Hopkins
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 53-57, November 5–10, 2006
Paper No: IMECE2006-13119
DOI: https://doi.org/10.1115/IMECE2006-13119
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Topics: Intermetallic compounds, Nanoelectronics, Solder joints, Solders, Temperature gradient, Tin