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Douglas DeVoto
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A018, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6456
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8262
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73143
Proceedings Papers

Proc. ASME. ES2009, ASME 2009 3rd International Conference on Energy Sustainability, Volume 2, 1041-1045, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ES2009-90474