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Ed J. Walsh
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Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency in another window
Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041006.
https://doi.org/10.1115/1.4007110
Published Online: October 30, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency in another window
Topics: Containment, Data centers, Heat, Heat sinks, Temperature, Air flow
Journal Articles

Identifying Turbulent Spots in Transitional Boundary Layers

Brendan Rehill, Ed J. Walsh, Luca Brandt, Philipp Schlatter, Tamer A. Zaki, Donald M. McEligot
Journal: Journal of Turbomachinery
Publisher: ASME
Article Type: Research-Article
J. Turbomach. January 2013, 135(1): 011019.
Paper No: TURBO-11-1121
https://doi.org/10.1115/1.4006395
Published Online: October 30, 2012
View Article titled, Identifying Turbulent Spots in Transitional Boundary Layers
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Topics: Boundary layers, Flow (Dynamics), Turbulence, Energy dissipation, Vortices
Proceedings Papers

Identifying Turbulent Spots in Transitional Boundary Layers

Brendan Rehill, Ed J. Walsh, Philipp Schlatter, Luca Brandt, Tamer A. Zaki, Donald M. McEligot
Proc. ASME. GT2011, Volume 5: Heat Transfer, Parts A and B, 1859-1868, June 6–10, 2011
Publisher: American Society of Mechanical Engineers
Paper No: GT2011-46385
https://doi.org/10.1115/GT2011-46385
View Paper titled, Identifying Turbulent Spots in Transitional Boundary Layers
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Topics: Boundary layers, Turbulence, Energy dissipation, Flow (Dynamics), Dimensions, Fluids, Robustness
Proceedings Papers

On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures

Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader, Thomas J. Breen, Ed J. Walsh, Jeff Punch
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 541-551, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52140
https://doi.org/10.1115/IPACK2011-52140
View Paper titled, On the Need for Energy Efficiency Metrics That Span Integrated IT-Facility Infrastructures
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Topics: Energy efficiency, Data centers, Energy consumption, Traction
Proceedings Papers

Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Niru Kumari, Cullen E. Bash, Scot Heath, Brandon Rubenstein
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 553-563, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52141
https://doi.org/10.1115/IPACK2011-52141
View Paper titled, Influence of Experimental Uncertainty on Prediction of Holistic Multi-Scale Data Center Energy Efficiency
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Topics: Data centers, Energy efficiency, Uncertainty, Stress, Temperature, Design, Experimental analysis, Flow (Dynamics), Air flow, Compressors
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 433-442, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52030
https://doi.org/10.1115/IPACK2011-52030
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and its Impact on Cooling Infrastructure Energy Efficiency in another window
Topics: Cooling, Cooling towers, Data centers, Energy efficiency, Leakage, Modeling, Operating temperature, Energy consumption, Heat, Accounting
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
https://doi.org/10.1115/1.4004657
Published Online: September 21, 2011
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
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Topics: Cooling, Cooling towers, Data centers, Heat sinks, Temperature, Temperature control, Modeling, Thermal resistance, Flow (Dynamics)
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011004.
https://doi.org/10.1115/1.4003274
Published Online: March 9, 2011
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
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Topics: Cooling, Cooling towers, Data centers, Temperature, Cooling systems, Heat, Modeling, Flow (Dynamics)
Proceedings Papers

From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Brandon Rubenstein, Scot Heath, Niru Kumari
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10074, March 13–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: AJTEC2011-44091
https://doi.org/10.1115/AJTEC2011-44091
View Paper titled, From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency
Open the PDF for From Chip to Cooling Tower Data Center Modeling: Influence of Air-Stream Containment on Operating Efficiency in another window
Topics: Containment, Cooling towers, Data centers, Modeling, Energy efficiency, Cooling systems, Air flow, Computers, Temperature, Cooling