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Filippo Cataldo
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Proceedings Papers

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
https://doi.org/10.1115/IPACK2022-97729
View Paper titled, Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling
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Topics: Computer cooling, Cooling, Cooling systems
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Proceedings Papers

Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data

Rémy Haynau, Jackson B. Marcinichen, Raffaele L. Amalfi, Filippo Cataldo, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72620
https://doi.org/10.1115/IPACK2021-72620
View Paper titled, Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data
Open the PDF for Compact Thermosyphon Cooling System For High Heat Flux Servers: Validation Of Thermosyphon Simulation Code Considering New Test Data in another window
Topics: Cooling systems, Heat flux, Simulation
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
Open the PDF for Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers in another window
Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041110.
Paper No: EP-21-1094
https://doi.org/10.1115/1.4052670
Published Online: November 5, 2021
View Article titled, Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6386
https://doi.org/10.1115/IPACK2019-6386
View Paper titled, Design of Passive Two-Phase Thermosyphons for Server Cooling
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
https://doi.org/10.1115/1.4039706
Published Online: May 9, 2018
View Article titled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
Open the PDF for Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a in another window
Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection