1-8 of 8
G. Y. Li
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process

Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, C. J. Hou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011003.
Paper No: EP-17-1089
https://doi.org/10.1115/1.4038861
Published Online: March 2, 2018
View Article titled, Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process
Open the PDF for Ripening Growth Kinetics of Cu 6 Sn 5 Grains in Sn-3.0Ag-0.5Cu- x TiO 2 /Cu Solder Joints During the Reflow Process in another window
Topics: Solder joints, Tin, Solders, Nanoparticles
Journal Articles

Transition of Wear Mechanisms of Plasma Source Nitrided AISI 316 Austenitic Stainless Steel Against Ceramic Counterface

G. Y. Li, Z. Y. Wang, M. K. Lei
Journal: Journal of Tribology
Publisher: ASME
Article Type: Friction And Wear
J. Tribol. January 2012, 134(1): 011601.
https://doi.org/10.1115/1.4005516
Published Online: February 24, 2012
View Article titled, Transition of Wear Mechanisms of Plasma Source Nitrided AISI 316 Austenitic Stainless Steel Against Ceramic Counterface
Open the PDF for Transition of Wear Mechanisms of Plasma Source Nitrided AISI 316 Austenitic Stainless Steel Against Ceramic Counterface in another window
Topics: Ceramics, Plasmas (Ionized gases), Stainless steel, Stress, Wear, Nitriding, Disks, Tribometers, Nitrogen, Temperature
Proceedings Papers

Hybrid and Adaptive Metamodel Based Global Optimization

J. Gu, G. Y. Li, Z. Dong
Proc. ASME. IDETC-CIE2009, Volume 5: 35th Design Automation Conference, Parts A and B, 751-765, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87121
https://doi.org/10.1115/DETC2009-87121
View Paper titled, Hybrid and Adaptive Metamodel Based Global Optimization
Open the PDF for Hybrid and Adaptive Metamodel Based Global Optimization in another window
Topics: Computation, Optimization
Proceedings Papers

Low Temperature Anodic Bonding for MEMS Applications

J. Wei, Z. P. Wang, L. Wang, G. Y. Li, Z. Q. Mo
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 61-66, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39272
https://doi.org/10.1115/IMECE2002-39272
View Paper titled, Low Temperature Anodic Bonding for MEMS Applications
Open the PDF for Low Temperature Anodic Bonding for MEMS Applications in another window
Topics: Bonding, Low temperature, Microelectromechanical systems, Taguchi methods
Journal Articles

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

B. L. Chen, X. Q. Shi, G. Y. Li, K. H. Ang, Jason P. Pickering
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 466–473.
https://doi.org/10.1115/1.2056574
Published Online: February 24, 2005
View Article titled, Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
Open the PDF for Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly in another window
Topics: Rapid tooling, Reliability, Temperature, Failure, Ball-Grid-Array packaging, Solder joints, Manufacturing, Solders, Testing
Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
Open the PDF for An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder in another window
Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Sheet Forming Analysis Based on Improved Contact Searching Algorithm and Simple Approach for Contact Force Evaluation

G. Y. Li, M. J. Tan, K. M. Liew, Z. H. Zhong
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Papers
J. Eng. Mater. Technol. January 2001, 123(1): 119–124.
https://doi.org/10.1115/1.1288594
Published Online: March 14, 2000
View Article titled, Sheet Forming Analysis Based on Improved Contact Searching Algorithm and Simple Approach for Contact Force Evaluation
Open the PDF for Sheet Forming Analysis Based on Improved Contact Searching Algorithm and Simple Approach for Contact Force Evaluation in another window
Topics: Algorithms, Blanks, Finite element analysis, Simulation
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
Open the PDF for Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM in another window
Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis