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Journal Articles

Actuation-Coordinated Mobile Parallel Robots With Hybrid Mobile and Manipulation Functions

Dongming Gan, Jiaming Fu, Han Lin, Haoguang Yang, Mo Rastgaar, Byung-Cheol Min, Richard Voyles
Journal: Journal of Mechanisms and Robotics
Article Type: Research Papers
J. Mechanisms Robotics. August 2022, 14(4): 041005.
Paper No: JMR-21-1535
DOI: https://doi.org/10.1115/1.4053821
Published Online: March 24, 2022
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Topics: Dynamics (Mechanics), Kinematics, Manipulators, Mobile robots, Robots, Wheels, Actuators, Rotation, Parallel mechanisms
Proceedings Papers

A Novel Feature Extraction Scheme for NPP Initiating Event Identification

Ting-Han Lin, Shun-Chi Wu, Hwai-Pwu Chou
Proc. ASME. ICONE24, Volume 1: Operations and Maintenance, Aging Management and Plant Upgrades; Nuclear Fuel, Fuel Cycle, Reactor Physics and Transport Theory; Plant Systems, Structures, Components and Materials; I&C, Digital Controls, and Influence of Human Factors, V001T04A013, June 26–30, 2016
Paper No: ICONE24-60672
DOI: https://doi.org/10.1115/ICONE24-60672
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Topics: Feature extraction, Nuclear power stations, Sensors
Proceedings Papers

Numerical Simulation of Convective Heat Transfer Characteristics of Aviation Kerosene Inside Elliptical Tubes Under Supercritical Pressure

Jingzhi Zhang, Naixiang Zhou, Jinpin Lin, Han Lin, Wei Li
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T11A022, January 4–6, 2016
Paper No: MNHMT2016-6608
DOI: https://doi.org/10.1115/MNHMT2016-6608
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Topics: Aviation, Computer simulation, Convection, Pressure, Heat transfer, Fluids, Heat transfer coefficients, Simulation, Temperature, Wall temperature
Proceedings Papers

Optimization of Cell Configuration for Maximizing Performance of a Cu/Cu 2+ Aqueous Thermogalvanic Cell

Chao-Han Lin, Andrey Gunawan, Patrick E. Phelan, Daniel A. Buttry, Vladimiro Mujica, Robert A. Taylor, Ravi Prasher
Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 541-547, November 9–15, 2012
Paper No: IMECE2012-88796
DOI: https://doi.org/10.1115/IMECE2012-88796
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Topics: Electrodes, Electrolytes, Energy conversion, Geometry, Optimization, Power density
Proceedings Papers

Failure Assessment for Girth Weld Defects of Pipeline

Qingshan Feng, Yi-han Lin, Bin Li, Hanchen Song
Proc. ASME. IPC2010, 2010 8th International Pipeline Conference, Volume 1, 339-345, September 27–October 1, 2010
Paper No: IPC2010-31211
DOI: https://doi.org/10.1115/IPC2010-31211
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Topics: Failure, Magnification, Pipelines, Stress
Proceedings Papers

Preliminary Failure Assessment for Spiral Welded Defects of Pipeline

Qingshan Feng, Yi-Han Lin, Fuxiang Wang, Bin Li
Proc. ASME. IPC2008, 2008 7th International Pipeline Conference, Volume 2, 93-101, September 29–October 3, 2008
Paper No: IPC2008-64059
DOI: https://doi.org/10.1115/IPC2008-64059
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Topics: Failure, Fracture (Materials), Fracture (Process), Pipelines
Proceedings Papers

Fabrication of Two-Dimensional Photonic Crystals on N-Type Silicon Substrate Using Holographic and Wet Etching Techniques

Han Lin, Shou Liu, Xiangsu Zhang
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 1315-1318, January 10–13, 2007
Paper No: MNC2007-21187
DOI: https://doi.org/10.1115/MNC2007-21187
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Topics: Chemical etching, Crystals, Manufacturing, Silicon, Etching, Dynamic light scattering, Lithography, Mass production, Periodic structures, Photoresists
Proceedings Papers

A Novel Self-Aligned Microcoil Formation for Magnetic Actuator Applications

Hung-Pin Chang, Jason Lin, Ruisheng Chang, Puo-Han Lin, Mark Bachman, Bob Reinicke, Joe Barbarits, G. P. Li
Proc. ASME. IMECE2004, Microelectromechanical Systems, 63-67, November 13–19, 2004
Paper No: IMECE2004-62288
DOI: https://doi.org/10.1115/IMECE2004-62288
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Topics: Actuators, Density
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
DOI: https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection