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Proceedings Papers

Electrorheology of Chitin and Chitosan Suspensions: Conductivity vs Molecular Structure

Ung-su Choi, Hans Conrad
Proc. ASME. IMECE98, Rheology and Fluid Mechanics of Nonlinear Materials, 145-151, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0458
https://doi.org/10.1115/IMECE1998-0458
View Paper titled, Electrorheology of Chitin and Chitosan Suspensions: Conductivity vs Molecular Structure
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Topics: Electrical conductivity, Electrorheological fluids, Thermal conductivity, Electric fields, Particulate matter, Flow (Dynamics), Fluids, Heat conduction, Rheology, Shear stress
Proceedings Papers

Effect of Particle Size and Distribution on the Viscosity of a Model Electrorheological (ER) Fluid

Ying Chen, Hans Conrad
Proc. ASME. IMECE99, Rheology and Fluid Mechanics of Nonlinear Materials, 105-115, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1175
https://doi.org/10.1115/IMECE1999-1175
View Paper titled, Effect of Particle Size and Distribution on the Viscosity of a Model Electrorheological (ER) Fluid
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Topics: Fluids, Particle size, Viscosity, Particulate matter, Silicones, Electrorheological fluids, Glass beads
Journal Articles

Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints

Zhenfeng Guo, Hans Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 49–54.
https://doi.org/10.1115/1.2792131
Published Online: June 1, 1996
View Article titled, Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints
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Topics: Deformation, Fatigue, Solder joints, Thermomechanics, Cooling, Creep, Fatigue cracks, Fatigue life, Stress, Temperature
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1993, 115(2): 139–140.
https://doi.org/10.1115/1.2909308
Published Online: June 1, 1993
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, John Lan, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1992, 114(2): 103.
https://doi.org/10.1115/1.2906403
Published Online: June 1, 1992
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies
Journal Articles

Correlation of High Temperature Creep and Rupture Data

Hans Conrad
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research Papers
J. Fluids Eng. December 1959, 81(4): 617–626.
https://doi.org/10.1115/1.4008574
Published Online: December 1, 1959
View Article titled, Correlation of High Temperature Creep and Rupture Data
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Topics: High temperature creep, Rupture, Creep, Aluminum alloys, Stress, Superalloys, Temperature
Journal Articles

Closure to “Discussion of ‘Correlation of High Temperature Creep and Rupture Data’” (1959, ASME J. Basic Eng., 81, pp. 626–627)

Hans Conrad
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Closures
J. Fluids Eng. December 1959, 81(4): 627–628.
https://doi.org/10.1115/1.4008576
Published Online: December 1, 1959
View Article titled, Closure to “Discussion of ‘Correlation of High Temperature Creep and Rupture Data’” (1959, ASME J. Basic Eng., 81, pp. 626–627)
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Topics: High temperature creep, Rupture