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Hendrik F. Hamann
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Proceedings Papers

Discrete Control of Air Conditioning Units in Mission Critical Facilities

Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein, Fernando J. Marianno, Alan C. Claassen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48593
https://doi.org/10.1115/IPACK2015-48593
View Paper titled, Discrete Control of Air Conditioning Units in Mission Critical Facilities
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Topics: Air conditioning, Fans, Automatic control, Control systems, Cooling, Data centers, Energy consumption, Failure, Redundancy (Engineering), Safety
Proceedings Papers

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
https://doi.org/10.1115/IPACK2015-48349
View Paper titled, Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers
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Topics: Air pollution, Data centers, Energy efficiency, Cooling, Corrosion, Temperature, Sensors, Air conditioning, Air flow, Contamination
Proceedings Papers

Optimization Algorithms for Energy-Efficient Data Centers

Hendrik F. Hamann
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73066
https://doi.org/10.1115/IPACK2013-73066
View Paper titled, Optimization Algorithms for Energy-Efficient Data Centers
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Topics: Data centers, Optimization algorithms, Cooling, Energy efficiency, Junctions, Linear programming
Proceedings Papers

A Statistical Approach to Thermal Zone Mapping

Hongfei Li, Hendrik F. Hamann
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 605-610, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52192
https://doi.org/10.1115/IPACK2011-52192
View Paper titled, A Statistical Approach to Thermal Zone Mapping
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Topics: Cooling, Data centers, Failure, Sensors, Structures, Temperature
Proceedings Papers

Humidity Control and Dew Point Management

Levente J. Klein, Hendrik F. Hamann
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 629-635, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52211
https://doi.org/10.1115/IPACK2011-52211
View Paper titled, Humidity Control and Dew Point Management
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Topics: Corrosion, Data centers, Energy efficiency, Failure, Hardware, Printed circuit boards, Reliability, Risk, Structures, Temperature distribution
Proceedings Papers

A Numerical Technique for the Approximation of Thermal Zones

Vanessa Lo´pez, Hendrik F. Hamann
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 637-644, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52213
https://doi.org/10.1115/IPACK2011-52213
View Paper titled, A Numerical Technique for the Approximation of Thermal Zones
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Topics: Air conditioning, Approximation, Boundary-value problems, Convection, Cooling systems, Data centers, Numerical analysis
Proceedings Papers

Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 445-449, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33796
https://doi.org/10.1115/IPACK2007-33796
View Paper titled, Fast and Accurate Simulation of Heat Transfer in Microarchitectures Using Frequency Domain Techniques
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Topics: Heat transfer, Simulation, Computation, Finite element methods, Frequency-domain analysis, Numerical analysis, Temperature profiles
Proceedings Papers

Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing

Keivan Etessam-Yazdani, Hendrik F. Hamann, Mehdi Asheghi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1033-1040, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33793
https://doi.org/10.1115/IPACK2007-33793
View Paper titled, Spatial Frequency Domain Analysis of Heat Transfer in Microelectronic Chips With Applications to Temperature Aware Computing
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Topics: Cooling, Frequency-domain analysis, Heat, Heat transfer, Packaging, Temperature, Thermal diffusion, Thermal energy, Transfer functions
Proceedings Papers

Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hotspots

Keivan Etessam-Yazdani, Mehdi Asheghi, Hendrik F. Hamann
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 349-356, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32868
https://doi.org/10.1115/HT2007-32868
View Paper titled, Experimental Investigation of Scaling Effect on Thermal Transport in Nanoscale Hotspots
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Topics: Dimensions, Electrical resistance, Heating, Joules, Nanoscale phenomena, Platinum, Sensors, Silicon, Temperature distribution, Temperature measurement
Proceedings Papers

Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials

Yizhang Yang, Taehee Jeong, Hendrik F. Hamann, Jimmy Zhu, Mehdi Asheghi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 925-932, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32830
https://doi.org/10.1115/HT2007-32830
View Paper titled, Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials
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Topics: Modeling, Thermal conductivity, Cycles, Data storage systems, Density, Disks, Electrical resistance, Jitter, Optimization, Phase change materials