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Proceedings Papers

Improvement of Sensitivity and Selectivity of Graphene-Based Gas Sensor by Strain

Xiangyu Qiao, Meng Yin, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A006, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112231
https://doi.org/10.1115/IMECE2023-112231
View Paper titled, Improvement of Sensitivity and Selectivity of Graphene-Based Gas Sensor by Strain
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Topics: Graphene, Sensors
Proceedings Papers

Sensitivity Improvement of Graphene-Based Gas Sensors by Direct Growth of Carbon Nanotubes on the Graphene

Ken Suzuki, Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Hideo Miura
Proc. ASME. IMECE2023, Volume 4: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V004T04A008, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-113221
https://doi.org/10.1115/IMECE2023-113221
View Paper titled, Sensitivity Improvement of Graphene-Based Gas Sensors by Direct Growth of Carbon Nanotubes on the Graphene
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Topics: Carbon nanotubes, Graphene, Sensors
Proceedings Papers

Acceleration of Creep-Fatigue Damage of Ni-Base Alloy by Viscoelasticity at Elevated Temperature

Hideo Miura, Ayane Yasumura, Takuma Yamawaki, Takuto Kudo, Hayato Matsuda, Le Xu
Proc. ASME. IMECE2023, Volume 11: Mechanics of Solids, Structures and Fluids, V011T12A021, October 29–November 2, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2023-112200
https://doi.org/10.1115/IMECE2023-112200
View Paper titled, Acceleration of Creep-Fatigue Damage of Ni-Base Alloy by Viscoelasticity at Elevated Temperature
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Topics: Alloys, Creep, Damage, Fatigue, Superalloys, Temperature, Viscoelasticity
Proceedings Papers

Improvement of the Sensitivity and Selectivity of Gas Molecules of Graphene-Base Gas Sensor With Carbon Nanotubes Under the Application of Strain

Yuto Hirose, Xiangyu Qiao, Wangyang Fu, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T13A013, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-95307
https://doi.org/10.1115/IMECE2022-95307
View Paper titled, Improvement of the Sensitivity and Selectivity of Gas Molecules of Graphene-Base Gas Sensor With Carbon Nanotubes Under the Application of Strain
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Topics: Carbon nanotubes, Graphene, Sensors
Proceedings Papers

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Ayumi Nakayama, Runzi Wang, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A047, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94701
https://doi.org/10.1115/IMECE2022-94701
View Paper titled, Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures
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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Temperature
Proceedings Papers

Effect of Strain Rate on the Creep-Fatigue Damage of Polycrystalline Ni-Base Superalloy at Elevated Temperature

Koki Nakayama, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A046, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94282
https://doi.org/10.1115/IMECE2022-94282
View Paper titled, Effect of Strain Rate on the Creep-Fatigue Damage of Polycrystalline Ni-Base Superalloy at Elevated Temperature
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Topics: Alloys, Creep, Damage, Electron backscatter diffraction, Fatigue, Fracture (Process), Superalloys, Temperature
Proceedings Papers

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A038, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94891
https://doi.org/10.1115/IMECE2022-94891
View Paper titled, Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures
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Topics: Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Stress, Temperature, Damage, Dislocations
Proceedings Papers

Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies

Run-Zi Wang, Ken Suzuki, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A020, October 30–November 3, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2022-94273
https://doi.org/10.1115/IMECE2022-94273
View Paper titled, Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies
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Topics: Creep, Event history analysis, Fatigue, Metamodeling
Proceedings Papers

Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules

Masasuke Kobayashi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A005, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70172
https://doi.org/10.1115/IMECE2021-70172
View Paper titled, Detachable Fine Bump Connection Using Multi-Walled Carbon-Nanotube Bundles for 3D Semiconductor Modules
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Topics: Carbon nanotubes, Ohmic contacts, Semiconductors (Materials), Multi-walled carbon nanotubes, Deformation, Silicon, Chemical vapor deposition, Compression, Contact resistance, Electrical properties
Proceedings Papers

Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures

Yukako Takahashi, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A005, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70108
https://doi.org/10.1115/IMECE2021-70108
View Paper titled, Acceleration Mechanism of Intergranular Cracking of SUS316L Under Creep-Fatigue Loading at Elevated Temperatures
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Topics: Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Temperature
Proceedings Papers

Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads

Shujiroh Suzuki, Shogo Tezuka, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A053, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70628
https://doi.org/10.1115/IMECE2021-70628
View Paper titled, Molecular Dynamics Analysis of the Acceleration of the Degradation of the Strength of a Grain Boundary Under Creep-Fatigue Loads
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Topics: Creep, Damage, Fatigue, Grain boundaries, Molecular dynamics, Stress, Superalloys
Proceedings Papers

Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique

Jowesh Avisheik Goundar, Qiao Xiangyu, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A008, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-69917
https://doi.org/10.1115/IMECE2021-69917
View Paper titled, Improvement in Photosensitivity of Dumbbell-Shaped Graphene Nanoribbon Structures by Using Asymmetric Metallization Technique
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Topics: Graphene, Shapes
Proceedings Papers

Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies

Yifan Luo, Shogo Tezuka, Koki Nakayama, Ayumi Nakayama, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T12A051, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-68489
https://doi.org/10.1115/IMECE2021-68489
View Paper titled, Creep-Fatigue Damage of Heat-Resistant Alloys Caused by the Local Lattice Mismatch-Induced Acceleration of the Generation and Accumulation of Dislocations and Vacancies
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Topics: Alloys, Creep, Damage, Dislocations, Electron backscatter diffraction, Fatigue, Grain boundaries, Heat, Stress, Diffusion (Physics)
Proceedings Papers

Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density

Shota Akasaki, Hideo Miura
Proc. ASME. IMECE2021, Volume 12: Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging, V012T13A002, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70222
https://doi.org/10.1115/IMECE2021-70222
View Paper titled, Crystallinity-Induced Acceleration of Intergranular Cracking in Thin-Film Interconnections Under High Current Density
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Topics: Cracking (Materials), Current density, Fracture (Process), Thin films, Grain boundaries, Electron backscatter diffraction, Bulk solids, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion
Proceedings Papers

Microtexture Dependence of Mechanical and Electrical Properties of Gold Thin Films Used for Micro Bumps of 3D Stacking Structures

Genta Nakauchi, Shota Akasaki, Hideo Miura
Proc. ASME. IMECE2020, Volume 13: Micro- and Nano-Systems Engineering and Packaging, V013T13A002, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-23441
https://doi.org/10.1115/IMECE2020-23441
View Paper titled, Microtexture Dependence of Mechanical and Electrical Properties of Gold Thin Films Used for Micro Bumps of 3D Stacking Structures
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Topics: Electrical properties, Electron backscatter diffraction, Mechanical properties, Texture (Materials), Thin films
Proceedings Papers

Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis

Shin Kasama, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A014, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-23354
https://doi.org/10.1115/IMECE2020-23354
View Paper titled, Non-Destructive Evaluation of the Degradation of Ni-Base Superalloy in the Air by Reflectance Spectrum Analysis
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Topics: Creep, Damage, Emission spectroscopy, Fatigue, Nondestructive evaluation, Reflectance, Spectroscopy, Superalloys
Proceedings Papers

Damage Mechanism of the Acceleration of Intergranular Cracking of Stainless Steel SUS316LN Under Creep Loading at Elevated Temperatures

Chongzhe Gu, Yukako Takahashi, Hideo Miura
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A061, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-23693
https://doi.org/10.1115/IMECE2020-23693
View Paper titled, Damage Mechanism of the Acceleration of Intergranular Cracking of Stainless Steel SUS316LN Under Creep Loading at Elevated Temperatures
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Topics: Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Temperature
Proceedings Papers

Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C

Kenta Ishihara, Yifan Luo, Hideo Miura
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A062, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-23738
https://doi.org/10.1115/IMECE2020-23738
View Paper titled, Acceleration of Grain Boundary Cracking in Ni-Base Alloy 617 Under Creep-Fatigue Loading at 800°C
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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fatigue, Fracture (Process), Grain boundaries
Proceedings Papers

Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature

Yukako Takahashi, Yifan Luo, Kenta Ishihara, Shujiro Suzuki, Hideo Miura
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A071, November 16–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2020-24473
https://doi.org/10.1115/IMECE2020-24473
View Paper titled, Degradation of the Strength of a Grain Boundary of Ni-Base Superalloys Under Creep-Fatigue Loading at Elevated Temperature
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Topics: Creep, Electron backscatter diffraction, Fatigue, Grain boundaries, Superalloys, Temperature
Proceedings Papers

Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures

Yan Liang, Yifan Luo, Ken Suzuki, Hideo Miura
Proc. ASME. IMECE2019, Volume 9: Mechanics of Solids, Structures, and Fluids, V009T11A056, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11186
https://doi.org/10.1115/IMECE2019-11186
View Paper titled, Grain Boundary Cracking of Nickel-Based Alloy 625 Under Creep Loadings at Elevated Temperatures
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Topics: Alloys, Cracking (Materials), Creep, Damage, Electron backscatter diffraction, Fracture (Materials), Fracture (Process), Grain boundaries, Nickel, Temperature