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Hiroyuki Abe
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Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0513
https://doi.org/10.1115/IMECE1997-0513
View Paper titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Proceedings Papers

A New Approach to Calculate Atomic Flux Divergence by Electromigration

Kazuhiko Sasagawa, Naoaki Nakamura, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 145-152, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0510
https://doi.org/10.1115/IMECE1997-0510
View Paper titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
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Topics: Electrodiffusion, Current density, Temperature, Corners (Structural elements), Metals, Modeling
Proceedings Papers

Analysis of Electromigration Considering Thomson Effect

Kazuhiko Sasagawa, Manabu Yagi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 87-92, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0433
https://doi.org/10.1115/IMECE1998-0433
View Paper titled, Analysis of Electromigration Considering Thomson Effect
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Topics: Electrodiffusion, Thermoelectricity, Temperature distribution, Metals, Corners (Structural elements), Current density, Damage, Temperature
Proceedings Papers

Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics

Tomoo Kayaba, Akinori Inoue, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 83-85, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0432
https://doi.org/10.1115/IMECE1998-0432
View Paper titled, Study of Nucleation of Diamond on Silicon Substrate by Ab-Initio Molecular Dynamics
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Topics: Diamonds, Molecular dynamics, Nucleation (Physics), Silicon, Atoms, Carbon, Chemical vapor deposition, Diamond films, Simulation, Aluminum
Proceedings Papers

Effects of Wind Environment on Propeller Performance of Multirotor Drone in Hover

Motonao Murakami, Hiroyuki Abe, Hikaru Aono, Hitoshi Ishikawa
Proc. ASME. AJKFluids2019, Volume 4: Fluid Measurement and Instrumentation; Micro and Nano Fluid Dynamics, V004T04A004, July 28–August 1, 2019
Publisher: American Society of Mechanical Engineers
Paper No: AJKFluids2019-4854
https://doi.org/10.1115/AJKFluids2019-4854
View Paper titled, Effects of Wind Environment on Propeller Performance of Multirotor Drone in Hover
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Topics: Propellers, Unmanned aerial vehicles, Wind, Cross-flow, Design, Flight, Flow (Dynamics), Thrust, Torque, Torque measurement
Proceedings Papers

Current Status of 300 kW Industrial Gas Turbine R&D in Japan

Takumi Murayama, Kunihiro Nagata, Hiroyuki Abe, Hisao Ogiyama
Proc. ASME. GT1995, Volume 2: Aircraft Engine; Marine; Microturbines and Small Turbomachinery, V002T04A022, June 5–8, 1995
Publisher: American Society of Mechanical Engineers
Paper No: 95-GT-445
https://doi.org/10.1115/95-GT-445
View Paper titled, Current Status of 300 kW Industrial Gas Turbine R&D in Japan
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Topics: Industrial gases, Turbines, Engineering prototypes, Sunlight, Ceramics, Energy efficiency, Fuels, Gas turbines, Temperature
Proceedings Papers

Characteristics of a Turbine Cascade at Low Reynolds Numbers

Koji Murata, Hiroyuki Abe, Yasukata Tsutsui
Proc. ASME. GT1997, Volume 1: Aircraft Engine; Marine; Turbomachinery; Microturbines and Small Turbomachinery, V001T03A012, June 2–5, 1997
Publisher: American Society of Mechanical Engineers
Paper No: 97-GT-054
https://doi.org/10.1115/97-GT-054
View Paper titled, Characteristics of a Turbine Cascade at Low Reynolds Numbers
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Topics: Cascades (Fluid dynamics), Reynolds number, Turbines, Pressure, Airfoils, Wakes, Separation (Technology), Blades, Boundary layers, Bubbles
Proceedings Papers

Characteristics of an Annular Turbine Cascade at Low Reynolds Numbers

Takayuki Matsunuma, Hiroyuki Abe, Yasukata Tsutsui, Koji Murata
Proc. ASME. GT1998, Volume 1: Turbomachinery, V001T01A124, June 2–5, 1998
Publisher: American Society of Mechanical Engineers
Paper No: 98-GT-518
https://doi.org/10.1115/98-GT-518
View Paper titled, Characteristics of an Annular Turbine Cascade at Low Reynolds Numbers
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Topics: Cascades (Fluid dynamics), Reynolds number, Turbines, Flow (Dynamics), Blades, Separation (Technology), Suction, Vortices, Boundary layers, Ceramics
Proceedings Papers

Influence of Turbulence Intensity on Annular Turbine Stator Aerodynamics at Low Reynolds Numbers

Takayuki Matsunuma, Hiroyuki Abe, Yasukata Tsutsui
Proc. ASME. GT1999, Volume 1: Aircraft Engine; Marine; Turbomachinery; Microturbines and Small Turbomachinery, V001T03A030, June 7–10, 1999
Publisher: American Society of Mechanical Engineers
Paper No: 99-GT-151
https://doi.org/10.1115/99-GT-151
View Paper titled, Influence of Turbulence Intensity on Annular Turbine Stator Aerodynamics at Low Reynolds Numbers
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Topics: Aerodynamics, Reynolds number, Stators, Turbines, Turbulence, Separation (Technology), Flow (Dynamics), Pressure, Cascades (Fluid dynamics), Boundary layers
Proceedings Papers

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Yang Ju, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35117
https://doi.org/10.1115/IPACK2003-35117
View Paper titled, Microwave Imaging of Conductivity Distribution of Silicon Wafers
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Topics: Electrical conductivity, Imaging, Microwaves, Semiconductor wafers, Thermal conductivity, Reflectance, Sensors, Signals, Resolution (Optics)
Proceedings Papers

Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 717-722, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35064
https://doi.org/10.1115/IPACK2003-35064
View Paper titled, Expression of a Governing Parameter for Electromigration Damage on Metal Line Ends
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Topics: Damage, Electrodiffusion, Metals, Boundary-value problems, Current density, Failure, Computer simulation, Diffusion (Physics), Electric current, Grain boundaries
Proceedings Papers

Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness

Kazuhiko Sasagawa, Masataka Hasegawa, Naoki Yoshida, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 723-728, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35065
https://doi.org/10.1115/IPACK2003-35065
View Paper titled, Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness
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Topics: Electrodiffusion, Failure, Metals, Reliability, Computer simulation, Damage, Evaluation methods
Proceedings Papers

Failure Simulation of Angled Polycrystalline Lines Covered With Passivation Layer

Masataka Hasegawa, Kazuhiko Sasagawa, Masumi Saka, Hiroyuki Abe´
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 337-343, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39677
https://doi.org/10.1115/IMECE2002-39677
View Paper titled, Failure Simulation of Angled Polycrystalline Lines Covered With Passivation Layer
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Topics: Failure, Simulation, Electrodiffusion, Damage, Computer simulation, Corners (Structural elements), Density, Integrated circuits, Shapes
Journal Articles

Very Large-Scale Structures and Their Effects on the Wall Shear-Stress Fluctuations in a Turbulent Channel Flow up to Re τ = 640

Hiroyuki Abe, Hiroshi Kawamura, Haecheon Choi
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Technical Papers
J. Fluids Eng. September 2004, 126(5): 835–843.
https://doi.org/10.1115/1.1789528
Published Online: December 7, 2004
View Article titled, Very Large-Scale Structures and Their Effects on the Wall Shear-Stress Fluctuations in a Turbulent Channel Flow up to Re τ = 640
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Topics: Channel flow, Flow (Dynamics), Fluctuations (Physics), Reynolds number, Shear stress, Spectra (Spectroscopy), Turbulence
Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
https://doi.org/10.1115/1.1481374
Published Online: July 26, 2002
View Article titled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate
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Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite
Journal Articles

Direct Numerical Simulation of a Fully Developed Turbulent Channel Flow With Respect to the Reynolds Number Dependence

Hiroyuki Abe, Hiroshi Kawamura, Yuichi Matsuo
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Technical Papers
J. Fluids Eng. June 2001, 123(2): 382–393.
https://doi.org/10.1115/1.1366680
Published Online: February 16, 2001
View Article titled, Direct Numerical Simulation of a Fully Developed Turbulent Channel Flow With Respect to the Reynolds Number Dependence
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Topics: Channel flow, Flow (Dynamics), Reynolds number, Spectra (Spectroscopy), Stress, Turbulence, Energy dissipation, Fluctuations (Physics), Computer simulation, Computation