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Jason Fleischer
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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-92306
https://doi.org/10.1115/IPACK2022-92306
View Paper titled, Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods
Open the PDF for Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods in another window
Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Proceedings Papers

Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics

Beihan Zhao, Christopher Riso, David Leslie, Abhijit Dasgupta, Siddhartha Das, Jason Fleischer, Daniel Hines
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73197
https://doi.org/10.1115/IPACK2021-73197
View Paper titled, Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics
Open the PDF for Temperature Cycling Study of Aerosol-Jet Printed Conductive Silver Traces in Printed Electronics in another window
Topics: Aerosols, Electronics, Finite element methods, Finite element model, Modeling, Printing, Silver, Temperature