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Proceedings Papers

Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling

Jiansen Zhu, Daqing Zou, Sheng Liu, Jim Benson
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 141-148, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0728
https://doi.org/10.1115/IMECE1996-0728
View Paper titled, Thermal Behavior Study of Power Plastic Package by High Temperature Moire Interferometry and FEA Modeling
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Topics: Finite element analysis, High temperature, Interferometry, Modeling, Cooling, Finite element model, Cross section (Physics), Delamination, Diffraction gratings, Temperature
Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1111
https://doi.org/10.1115/IMECE1997-1111
View Paper titled, Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings
Proceedings Papers

Reliability Study of Package Stacking Under Thermomechanical Conditions

Jiansen Zhu, Kazuo Ishibahsi, Tommi Reinikainen
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 93-97, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81822
https://doi.org/10.1115/IMECE2005-81822
View Paper titled, Reliability Study of Package Stacking Under Thermomechanical Conditions
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Topics: Finite element analysis, Modeling, Printed circuit boards, Reliability, Simulation, Simulation results, Testing, Thermomechanics
Proceedings Papers

Hybrid Simulation Method for PWB Level Drop Tests

Jiansen Zhu, Esa Hussa, Juscelino Okura, Santosh Shetty
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 99-105, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-81825
https://doi.org/10.1115/IMECE2005-81825
View Paper titled, Hybrid Simulation Method for PWB Level Drop Tests
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Topics: Printed circuit boards, Simulation, Rubber, Vehicles, Deformation, Impulse (Physics), Materials properties, Modeling, Reliability, Shock (Mechanics)
Journal Articles

Three-Dimensional Modeling and Simulation of a Falling Electronic Device

Hua Shan, Jianzhong Su, Jiansen Zhu, Leon Xu
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research Papers
J. Comput. Nonlinear Dynam. January 2007, 2(1): 22–31.
https://doi.org/10.1115/1.2389039
Published Online: August 4, 2006
View Article titled, Three-Dimensional Modeling and Simulation of a Falling Electronic Device
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Topics: Center of mass, Collisions (Physics), Computer simulation, Damping, Dynamics (Mechanics), Finite element analysis, Friction, Simulation, Stiffness, Stress