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Jiawei Zhang
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Journal Articles

A General Theory and Analytical Solutions for Post-Buckling Behaviors of Thin Sheets

Jiawei Zhang, Xinghan Qiu, Changguo Wang, Yuanpeng Liu
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. June 2022, 89(6): 061003.
Paper No: JAM-21-1492
DOI: https://doi.org/10.1115/1.4053990
Published Online: March 16, 2022
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Topics: Bifurcation, Buckling, Design, Shear (Mechanics), Tension, Wavelength, Simulation
Journal Articles

Dynamic Analysis of Tram Vehicles Coupled With the Track System Based on Staggered Iterative Algorithm

Yao Shan, Binglong Wang, Shunhua Zhou, Jiawei Zhang, Aijun Huang
Journal: Journal of Computational and Nonlinear Dynamics
Article Type: Research-Article
J. Comput. Nonlinear Dynam. June 2020, 15(6): 061002.
Paper No: CND-19-1317
DOI: https://doi.org/10.1115/1.4046822
Published Online: April 13, 2020
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Topics: Vehicles, Rails, Wheels, Dynamic response
Journal Articles

Experimental Nonlinear Model Identification of a Highly Nonlinear Resonator

Tanju Yildirim, Jiawei Zhang, Shuaishuai Sun, Gursel Alici, Shiwu Zhang, Weihua Li
Journal: Journal of Vibration and Acoustics
Article Type: Technical Briefs
J. Vib. Acoust. June 2018, 140(3): 034502.
Paper No: VIB-17-1031
DOI: https://doi.org/10.1115/1.4039030
Published Online: February 9, 2018
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Topics: Free vibrations, Frequency response, Nonlinear estimation, Stiffness, Displacement, Resonance, Deformation, Excitation
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Paper No: IPACK2015-48009
DOI: https://doi.org/10.1115/IPACK2015-48009
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Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Thermal Cycling Reliability Predictions for PBGA Assemblies That Include Aging Effects

Mohammad Motalab, Muhannad Mustafa, Jeffrey C. Suhling, Jiawei Zhang, John Evans, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A008, July 16–18, 2013
Paper No: IPACK2013-73230
DOI: https://doi.org/10.1115/IPACK2013-73230
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Topics: Energy dissipation, Lead-free solders, Reliability, Solders