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Proceedings Papers

DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications

John Lau, Steve Erasmus, Fred Sporon-Fiedler, Chris Chang
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 163-168, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24720
https://doi.org/10.1115/IMECE2001/EPP-24720
View Paper titled, DSC, TMA, DMA, and TGA of Epoxies for Fiber-Optic Transceiver Applications
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Topics: Epoxy adhesives, Epoxy resins, Fibers, Absorption, Glass transition, Hardening (Curing), Materials properties, Storage, Temperature
Proceedings Papers

TSV Interposers With Embedded Microchannels for 3D IC and LED Integration

John Lau, Heng-Chieh Chien, Ray Tain
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 297-304, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52204
https://doi.org/10.1115/IPACK2011-52204
View Paper titled, TSV Interposers With Embedded Microchannels for 3D IC and LED Integration
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Topics: Microchannels, Silicon, Cooling, Optical instruments, Pressure drop, Structural design, System-in-package
Proceedings Papers

Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints

John Lau, S. W. Ricky Lee, Fubin Song, Dongkai Shangguan, Dennis C. Lau, Walter Dauksher
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1013-1019, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73362
https://doi.org/10.1115/IPACK2005-73362
View Paper titled, Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints
Open the PDF for Thermal-Fatigue Life Prediction Equation for Plastic Ball Grid Array (PBGA) SnAgCu Lead-Free Solder Joints in another window
Topics: Ball-Grid-Array packaging, Fatigue, Lead-free solders, Alloys, Failure mechanisms, Vehicles
Proceedings Papers

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

John Lau, Ricky Lee, Walter Dauksher, Dongkai Shangguan, Fubin Song, Dennis Lau
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1021-1029, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73364
https://doi.org/10.1115/IPACK2005-73364
View Paper titled, A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints
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Topics: Ball-Grid-Array packaging, Fatigue life, Lead-free solders, Reliability, Design, Fatigue, Manufacturing
Proceedings Papers

Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies

John Lau, Yida Zou, Sergio Camerlo
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 195-202, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39495
https://doi.org/10.1115/IMECE2002-39495
View Paper titled, Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies
Open the PDF for Effects of Void, Crack, and PCB Thickness on the Solder Joint Reliability of Wafer-Level Chip-Scale Package (WLCSP) Assemblies in another window
Topics: Fracture (Materials), Reliability, Semiconductor wafers, Solder joints, Creep, Fracture mechanics, Manufacturing, Printed circuit boards, Solders, Temperature
Proceedings Papers

Lead-Free Solder-Joint Reliability of a Photonic Device Under Transient and Steady State Loadings

Walter Dauksher, John Lau
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 387-394, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42253
https://doi.org/10.1115/IMECE2003-42253
View Paper titled, Lead-Free Solder-Joint Reliability of a Photonic Device Under Transient and Steady State Loadings
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Topics: Alloys, Boundary-value problems, Cavities, Creep, Energy generation, Lasers, Lead-free solders, Packaging, Photonic equipment, Relaxation (Physics)
Proceedings Papers

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)

John Lau, Walter Dauksher
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 229-238, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55041
https://doi.org/10.1115/IMECE2003-55041
View Paper titled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards)
Open the PDF for Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5Sn3.9Ag0.6Cu Lead-Free Solder Paste on PCBs (Printed Circuit Boards) in another window
Topics: Ceramics, Lead-free solders, Printed circuit boards, Reliability, Solders, Fatigue, Computers, Creep, Density, Energy dissipation
Proceedings Papers

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

John Lau, Walter Dauksher
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 257-263, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62492
https://doi.org/10.1115/IMECE2004-62492
View Paper titled, Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints
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Topics: Fatigue, Lead-free solders, Creep, Temperature, Ball-Grid-Array packaging, Cycles, Density
Proceedings Papers

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

John Lau, Ricky Lee, Dongkai Shangguan
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 265-270, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-62493
https://doi.org/10.1115/IMECE2004-62493
View Paper titled, Thermal Fatigue-Life Prediction of Lead-Free Solder Joints
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Topics: Fatigue life, Lead-free solders, Reliability, Ball-Grid-Array packaging, Design, Fatigue, Manufacturing
Proceedings Papers

Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints

Walter Dauksher, John Lau
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 23-28, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79984
https://doi.org/10.1115/IMECE2005-79984
View Paper titled, Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints
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Topics: Creep, Density, Fatigue, Finite element analysis
Proceedings Papers

Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints

John Lau, Walter Dauksher
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 299-324, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-79981
https://doi.org/10.1115/IMECE2005-79981
View Paper titled, Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints
Open the PDF for Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints in another window
Topics: Cavities, Failure analysis, Finishes, Flip-chip, Lasers, Low temperature, Solder joints
Journal Articles

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

John Lau, ASME Fellow, Walter Dauksher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
https://doi.org/10.1115/1.1846069
Published Online: June 3, 2005
View Article titled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)
Open the PDF for Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) in another window
Topics: Ceramics, Creep, Cycles, Lead-free solders, Reliability, Solders, Temperature, Printed circuit boards, Fatigue, Weibull distribution
Journal Articles

Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

John Lau, Eric Schneider, Tom Baker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1996, 118(2): 101–104.
https://doi.org/10.1115/1.2792127
Published Online: June 1, 1996
View Article titled, Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
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Topics: Copper, Flip-chip, Flip-chip devices, Lumber, Shock (Mechanics), Solders, Vibration, Vibration tests, Epoxy adhesives, Epoxy resins
Journal Articles

Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads

John Lau, Suresh Golwalkar, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1994, 116(3): 234–237.
https://doi.org/10.1115/1.2905691
Published Online: September 1, 1994
View Article titled, Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads
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Topics: Copper, Wings, Alloys, Manufacturing, Solder joints, Stress
Journal Articles

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

John Lau, Steve Erasmus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 322–328.
https://doi.org/10.1115/1.2909335
Published Online: September 1, 1993
View Article titled, Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions
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Topics: Reliability, Solder joints, Corners (Structural elements), Fatigue, Fatigue life, Finite element methods, Solders, Stress, Thermal stresses
Journal Articles

Special Issue on Mechanics of Surface Mount Assemblies

Donald Barker, Hans Conrad, Peter Engel, Tai-Ran Hsu, John Lau, Yi-Hsin Pao, Anthony Rafanelli, Harvey Solomon, Donald Stone, Frank Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. June 1993, 115(2): 139–140.
https://doi.org/10.1115/1.2909308
Published Online: June 1, 1993
View Article titled, Special Issue on Mechanics of Surface Mount Assemblies
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Topics: Surface mount assemblies