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Joseph A. Levert
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Proceedings Papers

The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load

Joseph A. Levert, David Haas, Chad S. Korach, Nicholas Lakomcik, Edward Peters
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 731-733, October 20–22, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2008-71217
https://doi.org/10.1115/IJTC2008-71217
View Paper titled, The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load
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Topics: Friction, Stress, Polishing, Slurries, Damage, Deflection, Dielectric materials, Integrated circuits, Manufacturing, Thin films
Proceedings Papers

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

Joo Hoon Choi, Yangro Lee, Louis E. DeMarco, Richard T. Leveille, Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 749-751, October 22–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2007-44383
https://doi.org/10.1115/IJTC2007-44383
View Paper titled, Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips
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Topics: Atomic force microscopy, Friction, Polishing, Particulate matter, Scanning probe microscopy, Circuits, Damage, Delamination, Glass, Integrated circuit fabrication
Proceedings Papers

The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing

Joseph A. Levert, Chad S. Korach
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 427-428, September 12–16, 2005
Publisher: American Society of Mechanical Engineers
Paper No: WTC2005-63817
https://doi.org/10.1115/WTC2005-63817
View Paper titled, The Relative Friction Force Contributions of Polishing Pads and Slurries During Chemical Mechanical Polishing
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Topics: Friction, Polishing, Slurries, Nanoscale phenomena, Dielectric materials, Damage, Integrated circuits, Particulate matter, Shear (Mechanics), Silicon
Proceedings Papers

CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter

Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2006, Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology, 981-986, October 23–25, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IJTC2006-12235
https://doi.org/10.1115/IJTC2006-12235
View Paper titled, CMP Friction as a Function of Slurry Silica Nanoparticle Concentration and Diameter
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Topics: Friction, Nanoparticles, Slurries, Particulate matter, Atomic force microscopy, Damage, Dielectric materials, Abrasives, Integrated circuits, Nanoscale phenomena
Journal Articles

Mechanism for Subambient Interfacial Pressures While Polishing With Liquids

Joseph A. Levert, Steven Danyluk, John Tichy
Journal: Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. April 2000, 122(2): 450–457.
https://doi.org/10.1115/1.555381
Published Online: August 24, 1999
View Article titled, Mechanism for Subambient Interfacial Pressures While Polishing With Liquids
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Topics: Modeling, Pressure, Semiconductor wafers, Polishing, Stress, Compression