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1-14 of 14
Kazuhiro Fujisaki
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
Published Online: January 28, 2022
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
Published Online: April 24, 2020
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
Journal Articles
Journal:
Journal of Medical Devices
Publisher: ASME
Article Type: Technical Briefs
J. Med. Devices. September 2016, 10(3): 030964.
Paper No: MED-16-1098
Published Online: August 1, 2016
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
Published Online: September 19, 2014
Proceedings Papers
Toshihiro Sera, Hideo Yokota, Kazuhiro Fujisaki, Kazuaki Fukasaku, Kentaro Uesugi, Naoto Yagi, Ryutaro Himeno
Proc. ASME. SBC2007, ASME 2007 Summer Bioengineering Conference, 557-558, June 20–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: SBC2007-176272
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
Journal Articles
Journal:
Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Technical Briefs
J Biomech Eng. May 2012, 134(5): 054502.
Published Online: May 25, 2012
Journal Articles
Journal:
Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research Papers
J Biomech Eng. March 2010, 132(3): 031004.
Published Online: February 4, 2010
Proceedings Papers
Proc. ASME. IMECE2004, Advances in Bioengineering, 193-194, November 13–19, 2004
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2004-59253