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Kentaro Uesugi
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Journal Articles

Experimental Approach for Clarifying Initiation and Growth Behaviors of Internal Fatigue Cracks Using Synchrotron Radiation Multiscale X-ray Computed Tomography

Takashi Nakamura, Gaoge Xue, Yuma Kon, Nao Fujimura, Takuya Yamazaki, Nobuyuki Tonozaki, Akihisa Takeuchi, Masayuki Uesugi, Kentaro Uesugi
Journal: Materials Performance and Characterization
Publisher: ASTM International
Article Type: Technical Papers
Matls. Perf. Charact.. November 2023, 12(2): 107–128.
Paper No: MPC20230023
https://doi.org/10.1520/MPC20230023
Published Online: November 10, 2023
View Article titled, Experimental Approach for Clarifying Initiation and Growth Behaviors of Internal Fatigue Cracks Using Synchrotron Radiation Multiscale X-ray Computed Tomography
Open the PDF for Experimental Approach for Clarifying Initiation and Growth Behaviors of Internal Fatigue Cracks Using Synchrotron Radiation Multiscale X-ray Computed Tomography in another window
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
https://doi.org/10.1115/IPACK2015-48553
View Paper titled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
Open the PDF for Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography in another window
Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Development of 4-D High-Resolution CT for Measurement of Airway Deformation

Toshihiro Sera, Hideo Yokota, Kazuhiro Fujisaki, Kazuaki Fukasaku, Kentaro Uesugi, Naoto Yagi, Ryutaro Himeno
Proc. ASME. SBC2007, ASME 2007 Summer Bioengineering Conference, 557-558, June 20–24, 2007
Publisher: American Society of Mechanical Engineers
Paper No: SBC2007-176272
https://doi.org/10.1115/SBC2007-176272
View Paper titled, Development of 4-D High-Resolution CT for Measurement of Airway Deformation
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Topics: Deformation, Resolution (Optics), Dynamics (Mechanics), Flow (Dynamics), Geometry, Particulate matter, Radiation (Physics), Surfactants, Trachea
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Open the PDF for Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints in another window
Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33170
https://doi.org/10.1115/IPACK2007-33170
View Paper titled, Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects in another window
Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography
Proceedings Papers

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

Toshihiko Sayama, Hiroyuki Tsuritani, Kentaro Uesugi, Akira Tsuchiyama, Tsukasa Nakano, Hideyuki Yasuda, Takeshi Takayanagi, Takao Mori
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1115-1121, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73083
https://doi.org/10.1115/IPACK2005-73083
View Paper titled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Joining, Reliability, Tin, Cycles, Density, Flip-chip
Journal Articles

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

Hiroyuki Tsuritani, Toshihiko Sayama, Kentaro Uesugi, Takeshi Takayanagi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 434–439.
https://doi.org/10.1115/1.2804093
Published Online: May 2, 2007
View Article titled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
Open the PDF for Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography in another window
Topics: Cycles, Nondestructive evaluation, Solders, X-rays, Synchrotron radiation, Flip-chip devices, Tin, Reliability, Computerized tomography