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Koneru Ramakrishna
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Proceedings Papers

Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages

Bahgat Sammakia, Koneru Ramakrishna, Frank Andros, Jayathi Y. Murthy, Vijay Sarihan, D. H. R. Sarma, Sanjeev Sathe
Proc. ASME. IMECE2001, Manufacturing Engineering, 461-463, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MED-23350
https://doi.org/10.1115/IMECE2001/MED-23350
View Paper titled, Some Transport Issues in the Development, Qualification, and Manufacture of Electronic Packages
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Topics: Adhesives, Computer cooling, Computer simulation, Computers, Concurrent engineering, Design, Drilling, Electronic packages, Electronics, Engineering design processes
Proceedings Papers

Numerical Optimization Study for a Parallel Plate Impingement Heat Sink

Amit Shah, Bahgat Sammakia, Hari Srihari, Koneru Ramakrishna
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 485-495, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35236
https://doi.org/10.1115/IPACK2003-35236
View Paper titled, Numerical Optimization Study for a Parallel Plate Impingement Heat Sink
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Topics: Heat sinks, Optimization, Fins, Design, Numerical analysis, Pressure drop, Shape optimization
Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
https://doi.org/10.1115/1.2957318
Published Online: July 29, 2008
View Article titled, A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
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Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks
Journal Articles

Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy

Siva P. Gurrum, William P. King, Yogendra K. Joshi, Koneru Ramakrishna
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 2008, 130(8): 082403.
https://doi.org/10.1115/1.2928014
Published Online: May 30, 2008
View Article titled, Size Effect on the Thermal Conductivity of Thin Metallic Films Investigated by Scanning Joule Expansion Microscopy
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Topics: Metals, Temperature, Thermal conductivity, Metallic films, Joules, Microscopy, Size effect, Heating
Proceedings Papers

A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 441-445, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-41596
https://doi.org/10.1115/IMECE2003-41596
View Paper titled, A Novel Compact Method for Thermal Modeling of On-Chip Interconnects Based on the Finite Element Method
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Topics: Finite element methods, Heating, Joules, Modeling, Temperature, Engineering simulation, Simulation, Storage, Current density, Design
Proceedings Papers

Joule Heating and Thermal Conductivity Determination of Nanoscale Metallic Thin Films and Interconnects

Siva P. Gurrum, William P. King, Yogendra K. Joshi, Koneru Ramakrishna
Proc. ASME. IMECE2005, Heat Transfer, Part A, 851-854, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82909
https://doi.org/10.1115/IMECE2005-82909
View Paper titled, Joule Heating and Thermal Conductivity Determination of Nanoscale Metallic Thin Films and Interconnects
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Topics: Heating, Joules, Metallic thin films, Nanoscale phenomena, Thermal conductivity, Electrons, Mean free path, Metallic films, Temperature, Current density
Journal Articles

Scanning Joule Expansion Microscopy of a Constriction in Thin Metallic Film

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2005, 127(8): 809.
https://doi.org/10.1115/1.2033315
Published Online: August 1, 2005
View Article titled, Scanning Joule Expansion Microscopy of a Constriction in Thin Metallic Film
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Topics: Boiling, Bubbles, Chemically reactive flow, Combustion, Confined flow, Flow visualization, Forced convection, Joules, Mass transfer, Metallic films