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Leila Choobineh
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Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021104.
Paper No: EP-20-1142
https://doi.org/10.1115/1.4052074
Published Online: September 24, 2021
View Article titled, Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model
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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2562
https://doi.org/10.1115/IPACK2020-2562
View Paper titled, Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Journal Articles

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach

Leila Choobineh, Robert Carrol, Carlos Gutierrez, Robert Geer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031106.
Paper No: EP-19-1098
https://doi.org/10.1115/1.4046848
Published Online: April 24, 2020
View Article titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
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Topics: Bonding, Columns (Structural), Copper, Design, Gates (Closures), Manufacturing, Modeling, Semiconductor wafers, Silicon, Tiles
Proceedings Papers

Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6334
https://doi.org/10.1115/IPACK2019-6334
View Paper titled, Optimal Arrangement of Multiple Heat Sources in Vertically Stacked Two-Layer 3-D IC Using Genetic Algorithm
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Topics: Artificial neural networks, Genetic algorithms, Heat
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74222
https://doi.org/10.1115/IPACK2017-74222
View Paper titled, Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices
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Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride
Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
https://doi.org/10.1115/1.4036404
Published Online: June 12, 2017
View Article titled, Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits
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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis
Proceedings Papers

Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC

Leila Choobineh, Ankur Jain, Jared Jones
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A001, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65543
https://doi.org/10.1115/IMECE2016-65543
View Paper titled, Experimental Measurement of Inter-Die Thermal Resistance in a Two Die 3D IC
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Topics: Thermal resistance, Computer simulation, Design, Temperature, Boundary-value problems, Data acquisition, Heating, Modeling, Reliability, Thermal analysis
Proceedings Papers

Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect

Arya Banait, Vivek Vishwakarma, Leila Choobineh, Ankur Jain
Proc. ASME. IMECE2013, Volume 7A: Fluids Engineering Systems and Technologies, V07AT08A006, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-65865
https://doi.org/10.1115/IMECE2013-65865
View Paper titled, Growth of Patterned Micropores in Poly-Dimethylsiloxane (PDMS) Using the Thermocapillary Effect
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Topics: Plasma desorption mass spectrometry, Bubbles, Membranes, Biocompatibility, Design, Filtration, Glass, Hardening (Curing), Heating, Microchannels
Proceedings Papers

Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems

Leila Choobineh, Dereje Agonafer, Ankur Jain
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73166
https://doi.org/10.1115/IPACK2013-73166
View Paper titled, Analytical Modeling of Temperature Distribution in Interposer-Based Microelectronic Systems
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Topics: Modeling, Temperature distribution, Thermal management, Temperature, Finite element analysis, Heat transfer, Design, Energy conservation, Fourier series, Heat
Proceedings Papers

Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)

Leila Choobineh, Nick Vo, Trent Uehling, Ankur Jain
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A034, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73167
https://doi.org/10.1115/IPACK2013-73167
View Paper titled, Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)
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Topics: Integrated circuits