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Proceedings Papers

Mechanical Test of FPCB and Failure Analysis by Simulation

Jian Zhong, Ping Yang, Jian-ping Li, Hai-bo Sun, Quayle Chen, Leon Xu, Antti Salo
Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 847-851, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87200
https://doi.org/10.1115/DETC2009-87200
View Paper titled, Mechanical Test of FPCB and Failure Analysis by Simulation
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Topics: Failure analysis, Mechanical testing, Reliability, Simulation, Simulation analysis
Proceedings Papers

Reliability of the Flexible Display STN LCD Based Environmental Test

Pan-Dong Fan, Qiang Miao, Ping Yang, Quayle Chen, Tom Xue, Leon Xu, Antti Salo
Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 725-729, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87097
https://doi.org/10.1115/DETC2009-87097
View Paper titled, Reliability of the Flexible Display STN LCD Based Environmental Test
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Topics: Reliability, Heat, Failure, Failure mechanisms, Brightness (Photometry), Electronic packages, Inspection, Polymers, Temperature
Proceedings Papers

Design and Simulation of Piezoelectric Micro-Cantilever Ultrasonic Transducers for Audio Directional Loudspeakers

Teng Ma, Chenguang Cai, Limei Xu, Leon Xu, Xia Wang, Jian Ma, Chuankai Qiu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 143-148, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70135
https://doi.org/10.1115/MicroNano2008-70135
View Paper titled, Design and Simulation of Piezoelectric Micro-Cantilever Ultrasonic Transducers for Audio Directional Loudspeakers
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Topics: Design, Loudspeakers, Microcantilevers, Simulation, Ultrasonic transducers, Manufacturing, Microelectromechanical systems, Transducers, Cantilevers, Finite element methods
Proceedings Papers

Finite Element Analysis Based Design Optimization of Exciting Efficiency for Micromachined Piezoelectric Transducer

Chenguang Cai, Quayle Chen, Dujuan Zeng, Fei Deng, Antti Salo, Leon Xu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 217-221, June 3–5, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MicroNano2008-70265
https://doi.org/10.1115/MicroNano2008-70265
View Paper titled, Finite Element Analysis Based Design Optimization of Exciting Efficiency for Micromachined Piezoelectric Transducer
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Topics: Design, Finite element analysis, Micromachining, Optimization, Piezoelectric transducers, Transducers, Membranes, Stress, Diaphragms (Mechanical devices), Diaphragms (Structural)
Journal Articles

Three-Dimensional Modeling and Simulation of a Falling Electronic Device

Hua Shan, Jianzhong Su, Jiansen Zhu, Leon Xu
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research Papers
J. Comput. Nonlinear Dynam. January 2007, 2(1): 22–31.
https://doi.org/10.1115/1.2389039
Published Online: August 4, 2006
View Article titled, Three-Dimensional Modeling and Simulation of a Falling Electronic Device
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Topics: Center of mass, Collisions (Physics), Computer simulation, Damping, Dynamics (Mechanics), Finite element analysis, Friction, Simulation, Stiffness, Stress
Journal Articles

Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations

Abhishek Gupta, Yu Ding, Leon Xu, Tommi Reinikainen
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. August 2006, 128(3): 705–715.
https://doi.org/10.1115/1.2193551
Published Online: August 28, 2005
View Article titled, Optimal Parameter Selection for Electronic Packaging Using Sequential Computer Simulations
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Topics: Computer simulation, Design, Electronic packaging, Finite element analysis, Response surface methodology, Simulation, Uncertainty, Stress