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Journal Articles

Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method

S. Kim, M. Mayer, J. Persic, J. T. Moon
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011002.
Paper No: EP-13-1089
DOI: https://doi.org/10.1115/1.4028281
Published Online: October 6, 2014
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Topics: Temperature, Wire
Proceedings Papers

On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires

C. J. Hang, I. Lum, J. Lee, M. Mayer, Y. Zhou, C. Q. Wang, S. J. Hong, S. M. Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 25-30, July 8–12, 2007
Paper No: IPACK2007-33046
DOI: https://doi.org/10.1115/IPACK2007-33046
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Topics: Bonding, Copper, Wire
Proceedings Papers

Atomic Layer Deposition of Solid Lubricant Thin Films

T. W. Scharf, S. V. Prasad, M. T. Dugger, T. M. Mayer
Proc. ASME. WTC2005, World Tribology Congress III, Volume 2, 375-376, September 12–16, 2005
Paper No: WTC2005-63566
DOI: https://doi.org/10.1115/WTC2005-63566
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Topics: Lubricants, Thin films, Chemical vapor deposition, Transition metals, Chemistry, Dimensions, Evaporation, Friction, High temperature, Laser ablation
Journal Articles

Textile Machinery Research 1948–1978

M. Mayer, Jr.
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. February 1979, 101(1): 45–53.
DOI: https://doi.org/10.1115/1.3439472
Published Online: February 1, 1979
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Topics: Textile machinery, Machinery, Textile processing
Journal Articles

A Unique Cotton Sliver Drafting System

L. B. DeLuca, M. Mayer, Jr.
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. February 1977, 99(1): 61–64.
DOI: https://doi.org/10.1115/1.3439166
Published Online: February 1, 1977
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Topics: Engineering drawing and drafting, Fibers, Relaxation (Physics)