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Man Prakash Gupta
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Journal Articles

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021003.
Paper No: EP-22-1092
https://doi.org/10.1115/1.4062924
Published Online: September 20, 2023
View Article titled, Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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Topics: Bonding, Copper, Microchannels, Polishing, Manifolds, Solders
Journal Articles

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011006.
Paper No: EP-22-1093
https://doi.org/10.1115/1.4062384
Published Online: June 7, 2023
View Article titled, Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
Open the PDF for Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module in another window
Topics: Manifolds, Microchannels, Pressure drop, Flow (Dynamics), Thermal resistance, Cooling, Computational fluid dynamics
Journal Articles

Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers

Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021008.
Paper No: EP-22-1046
https://doi.org/10.1115/1.4055468
Published Online: September 28, 2022
View Article titled, Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Open the PDF for Numerical Study of Large Footprint (24 × 24 mm 2 ) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers in another window
Topics: Flow (Dynamics), Manifolds, Microchannels, Silicon, Pressure, Temperature, Intake manifolds, Pressure drop
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031118.
Paper No: EP-20-1032
https://doi.org/10.1115/1.4047883
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm 2 ) Power Electronics Cooling in another window
Topics: Computational fluid dynamics, Design, Fluids, Manifolds, Microchannels, Pressure drop, Simulation, Coolers
Proceedings Papers

Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling

Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Mike Degner, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A021, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6472
https://doi.org/10.1115/IPACK2019-6472
View Paper titled, Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm 2 ) Power Electronics Cooling
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Topics: Computational fluid dynamics, Computer cooling, Coolers, Heat flux, Manifolds, Microchannels, Silicon, Water
Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011005.
Paper No: EP-14-1012
https://doi.org/10.1115/1.4027995
Published Online: October 6, 2014
View Article titled, On-Chip Power Generation Using Ultrathin Thermoelectric Generators
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Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)
Proceedings Papers

A Dissipative Particle Dynamics Study of Liquid Crystals Under Electric Field

Man Prakash Gupta, Satish Kumar
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T10A005, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22125
https://doi.org/10.1115/MNHMT2013-22125
View Paper titled, A Dissipative Particle Dynamics Study of Liquid Crystals Under Electric Field
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Topics: Electric fields, Liquid crystals, Particle dynamics, Anisotropy, Equilibrium (Physics), Mesoscopic systems, Oscillations, Simulation
Proceedings Papers

High Field Breakdown of Carbon Nanotube Network Transistors

Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73115
https://doi.org/10.1115/IPACK2013-73115
View Paper titled, High Field Breakdown of Carbon Nanotube Network Transistors
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Topics: Carbon nanotubes, Transistors, Density, Heating, Reliability, Thin film transistors
Proceedings Papers

Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors

Man Prakash Gupta, David Estrada, Eric Pop, Satish Kumar
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 769-776, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75111
https://doi.org/10.1115/MNHMT2012-75111
View Paper titled, Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors
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Topics: Carbon nanotubes, Transistors, Density, Thermal conductivity, Thin film transistors, Energy dissipation, Geometry, Simulation results, Statistics, Temperature
Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
https://doi.org/10.1115/1.4006141
Published Online: June 11, 2012
View Article titled, Array of Thermoelectric Coolers for On-Chip Thermal Management
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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control
Journal Articles

Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Electronic Cooling
J. Heat Mass Transfer. June 2012, 134(6): 061401.
https://doi.org/10.1115/1.4006012
Published Online: May 2, 2012
View Article titled, Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors
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Topics: Temperature, Thermal management
Proceedings Papers

Thermoelectric Coolers for Thermal Gradient Management on Chip

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 187-195, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38184
https://doi.org/10.1115/IMECE2010-38184
View Paper titled, Thermoelectric Coolers for Thermal Gradient Management on Chip
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Topics: Temperature gradient, Thermoelectric coolers, Cooling, Temperature, Transients (Dynamics), Electronic packages, Flat heat pipes, Shapes
Proceedings Papers

An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile

Man Prakash Gupta, Minki Cho, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 153-163, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52094
https://doi.org/10.1115/IPACK2011-52094
View Paper titled, An Investigation of Power Migration Policies for Many-Core Processors to Manage On-Chip Thermal Profile
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Topics: Electronic packages, Energy dissipation, Integrated circuits, Reliability, Temperature, Temperature gradient, Thermal management