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Proceedings Papers

Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design

Gabor Farkas, Andras Vass-Varnai, Lajos Gaal, Marta Rencz
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6547
https://doi.org/10.1115/IPACK2019-6547
View Paper titled, Modeling of Light Emitting Device Populations in the Electrical, Thermal, and Optical Domain for Luminaire Design
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Topics: Design, Modeling, Physics
Journal Articles

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Marta Rencz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
https://doi.org/10.1115/1.3565444
Published Online: March 10, 2011
View Article titled, Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
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Topics: Cooling, Electronic packaging, Heat transfer, Integrated circuits, Microchannel flow
Journal Articles

Foreword

Marta Rencz ,, Guest Editor, Clemens Lasance ,, Guest Editor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 321–322.
https://doi.org/10.1115/1.1389845
Published Online: December 1, 2001
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Topics: Integrated circuit packaging, Integrated circuits, Micromechanical devices, Modeling, Packaging, Thermal management, Workshops (Work spaces)