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Matthew A. Hopcroft
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Proceedings Papers

CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators

Bongsang Kim, Matthew A. Hopcroft, Renata Melamud, Chandra M. Jha, Manu Agarwal, Saurabh A. Chandorkar, Thomas W. Kenny
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 499-504, July 8–12, 2007
Paper No: IPACK2007-33234
DOI: https://doi.org/10.1115/IPACK2007-33234
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Topics: Complementary metal oxide semiconductors, Microelectromechanical systems, Semiconductor wafers, Stability, Temperature, Composite materials, Packaging, Q-factor, Sealing (Process), Silicon
Proceedings Papers

MLHP: A High Heat Flux Localized Cooling Technology for Electronic Substrates

Navdeep S. Dhillon, Albert P. Pisano, Christopher Hogue, Matthew A. Hopcroft
Proc. ASME. IMECE2008, Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B, 621-630, October 31–November 6, 2008
Paper No: IMECE2008-66993
DOI: https://doi.org/10.1115/IMECE2008-66993
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Topics: Cooling, Heat flux, Design, Computer simulation, Microchannels, Microscale devices, Physics, Condensers (steam plant), Fluid dynamics, Heat
Proceedings Papers

In-Chip Device-Layer Thermal Isolation of MEMS Resonator for Lower Power Budget

Chandra M. Jha, Matthew A. Hopcroft, Manu Agarwal, Saurabh A. Chandorkar, Rob N. Candler, Vijay Subramaniun, Renata Melamud, Suhrid Bhat, Bongsang Kim, Kwan K. Park, Thomas W. Kenny
Proc. ASME. IMECE2006, Microelectromechanical Systems, 97-103, November 5–10, 2006
Paper No: IMECE2006-15176
DOI: https://doi.org/10.1115/IMECE2006-15176
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Topics: Microelectromechanical systems, Energy consumption, Heating, Joules, Design, Heat, Semiconductor wafers, Silicon, Temperature, Temperature effects