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Michael K. Patterson
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Proceedings Papers

A Field Investigation Into the Limits of High-Density Air-Cooling

Michael K. Patterson, Randall Martin, J. Barr von Oehsen, Jim Pepin, Yogendra Joshi, Vaibhav K. Arghode, Robin Steinbrecher, Jeff King
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A013, July 16–18, 2013
Paper No: IPACK2013-73163
https://doi.org/10.1115/IPACK2013-73163
View Paper titled, A Field Investigation Into the Limits of High-Density Air-Cooling
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Topics: Cooling, Density, Air flow, Data centers, Pressure, Computational fluid dynamics, Energy consumption, Flow (Dynamics), Imaging, Modeling
Proceedings Papers

Effect of Supply Air Temperature on Rack Cooling in a High Density Raised Floor Data Center Facility

Pramod Kumar, Vikneshan Sundaralingam, Yogendra Joshi, Michael K. Patterson, Robin Steinbrecher, Marissa Mena
Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1369-1380, November 11–17, 2011
Paper No: IMECE2011-65574
https://doi.org/10.1115/IMECE2011-65574
View Paper titled, Effect of Supply Air Temperature on Rack Cooling in a High Density Raised Floor Data Center Facility
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Topics: Cooling, Data centers, Density, Temperature, Temperature measurement
Proceedings Papers

An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures

Michael K. Patterson, Rainer Weidmann, Markus Leberecht, Manuel Mair, Richard M. Libby
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 479-488, July 6–8, 2011
Paper No: IPACK2011-52090
https://doi.org/10.1115/IPACK2011-52090
View Paper titled, An Investigation Into Cooling System Control Strategies for Data Center Airflow Containment Architectures
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Topics: Air flow, Architecture, Containment, Cooling systems, Data centers, Temperature, Energy consumption, Cooling, Fans, Hardware
Proceedings Papers

Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks

Pramod Kumar, Yogendra Joshi, Michael K. Patterson, Robin Steinbrecher, Marissa Mena
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 497-504, July 6–8, 2011
Paper No: IPACK2011-52117
https://doi.org/10.1115/IPACK2011-52117
View Paper titled, Cold Aisle Air Distribution in a Raised Floor Data Center With Heterogeneous Opposing Orientation Racks
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Topics: Data centers, Air flow, Heat, Stress, Tiles, Air conditioning, Computers, Density, Flow (Dynamics), Particulate matter
Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

Michael K. Patterson, Don Atwood, John G. Miner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009
Paper No: InterPACK2009-89358
https://doi.org/10.1115/InterPACK2009-89358
View Paper titled, Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
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Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating
Proceedings Papers

Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls

Michael K. Patterson, Michael Meakins, Dennis Nasont, Prasad Pusuluri, William Tschudi, Geoffrey C. Bell, Roger Schmidt, Ken Schneebeli, Tom Brey, Monty McGraw, Wade Vinson, Jason Gloeckner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1015-1020, July 19–23, 2009
Paper No: InterPACK2009-89359
https://doi.org/10.1115/InterPACK2009-89359
View Paper titled, Energy-Efficiency Through the Integration of Information and Communications Technology Management and Facilities Controls
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Topics: Energy efficiency, Technology management, Cooling systems, Data centers, Temperature, Temperature sensors, Air flow, Control systems, Cooling, Design
Proceedings Papers

Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2

Magnus K. Herrlin, Michael K. Patterson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 875-880, July 19–23, 2009
Paper No: InterPACK2009-89224
https://doi.org/10.1115/InterPACK2009-89224
View Paper titled, Energy-Efficient Air Cooling of Data Centers at 2000 W/ft 2
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Topics: Cooling, Data centers, Air flow, Density, Design, Heat, Computational fluid dynamics, Cooling systems, Energy efficiency, Control systems
Proceedings Papers

Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling

Michael K. Patterson, Xiaojin Wei, Yogendra Joshi
Proc. ASME. HT2005, Heat Transfer: Volume 4, 453-459, July 17–22, 2005
Paper No: HT2005-72647
https://doi.org/10.1115/HT2005-72647
View Paper titled, Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling
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Topics: Computational fluid dynamics, Cooling, Design, Heat exchangers, Microchannels, Microelectronic devices, Optimization, Circuits, Convection, Cooling systems
Proceedings Papers

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics

Xiaojin Wei, Yogendra Joshi, Michael K. Patterson
Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 105-111, November 13–19, 2004
Paper No: IMECE2004-62509
https://doi.org/10.1115/IMECE2004-62509
View Paper titled, Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics
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Topics: Cooling, Heat sinks, Microchannels, Microelectronic devices, Flow (Dynamics), Heat, Temperature, Platinum, Temperature uniformity, Heat exchangers
Journal Articles

Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices

Xiaojin Wei, Yogendra Joshi, Michael K. Patterson
Journal: Journal of Heat Transfer
Article Type: Technical Papers
J. Heat Transfer. October 2007, 129(10): 1432–1444.
https://doi.org/10.1115/1.2754781
Published Online: February 23, 2007
View Article titled, Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic Devices
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Topics: Cooling, Flow (Dynamics), Heat sinks, Heat transfer, Heating, Microchannels, Temperature, Microelectronic devices, Heat, Wall temperature