1-7 of 7
Min Pei
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components

Min Pei, Guru Arakere, Milena Vujosevic
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74082
https://doi.org/10.1115/IPACK2017-74082
View Paper titled, Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components
Open the PDF for Knowledge Based Qualification Methodology to Evaluate Shock Induced Risks in BGA Components in another window
Topics: Ball-Grid-Array packaging, Shock (Mechanics), Failure, Physics, Computer simulation, Deformation, Design, Stress
Proceedings Papers

Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification

Min Pei, Milena Vujosevic, Sibasish Mukherjee
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74081
https://doi.org/10.1115/IPACK2017-74081
View Paper titled, Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification
Open the PDF for Knowledge Based Requirement Calculation for Server BGAs Temperature Cycling (TC) Qualification in another window
Topics: Temperature, Ball-Grid-Array packaging, Fluctuations (Physics), Accounting, Damage, Engineering standards, Failure, Physics, Reliability, Risk assessment
Proceedings Papers

Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics

Helia Rahmani, Milena Vujosevic, Min Pei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A036, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48576
https://doi.org/10.1115/IPACK2015-48576
View Paper titled, Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics
Open the PDF for Shock Risk Assessment of BGA Components: Importance of Physics Based Metrics in another window
Topics: Ball-Grid-Array packaging, Physics, Risk assessment, Shock (Mechanics), Failure, Solder joints, Computer simulation, Damage, Stress
Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48578
https://doi.org/10.1115/IPACK2015-48578
View Paper titled, Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
Open the PDF for Physics Based Requirements for Qualification of BGA Components in Temperature Cycling in another window
Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage
Proceedings Papers

A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 115-120, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33703
https://doi.org/10.1115/IPACK2007-33703
View Paper titled, A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys
Open the PDF for A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys in another window
Topics: Alloys, Creep, Multiscale modeling, Solders, Tin, Particulate matter
Proceedings Papers

Effect of La Doping on SnAg Solder Microstructure Evolution

Min Pei, Jianmin Qu
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 407-413, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33701
https://doi.org/10.1115/IPACK2007-33701
View Paper titled, Effect of La Doping on SnAg Solder Microstructure Evolution
Open the PDF for Effect of La Doping on SnAg Solder Microstructure Evolution in another window
Topics: Lead-free solders, Particulate matter, Solders, Temperature, Tin
Journal Articles

Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys

Min Pei, Jianmin Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031004.
https://doi.org/10.1115/1.2957321
Published Online: July 29, 2008
View Article titled, Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys
Open the PDF for Hierarchal Modeling of Creep Behavior of SnAg Solder Alloys in another window
Topics: Alloys, Creep, Solders, Tin