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Journal Articles

Prediction of Friction Coefficients During Scratch Based on an Integrated Finite Element and Artificial Neural Network Method

Haibo Xie, Zhanjiang Wang, Na Qin, Wenhao Du, Linmao Qian
Journal: Journal of Tribology
Article Type: Research Papers
J. Tribol. February 2020, 142(2): 021703.
Paper No: TRIB-18-1430
DOI: https://doi.org/10.1115/1.4045013
Published Online: October 17, 2019
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Topics: Artificial neural networks, Finite element analysis, Friction, Shear (Mechanics), Simulation, Deformation
Proceedings Papers

Ultrasonic-Vibration-Assisted Grinding of Brittle Materials: A Mechanistic Model for Cutting Force

Na Qin, Z. J. Pei, W. L. Cong, C. Treadwell, D. M. Guo
Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1, 127-136, June 13–17, 2011
Paper No: MSEC2011-50055
DOI: https://doi.org/10.1115/MSEC2011-50055
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Topics: Brittleness, Cutting, Grinding, Silicon, Vibration
Proceedings Papers

Four Empirical Models for Pelleting of Cellulosic Biomass

Na Qin, Z. J. Pei
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 141-148, October 12–15, 2010
Paper No: MSEC2010-34201
DOI: https://doi.org/10.1115/MSEC2010-34201
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Topics: Biofuel, Biomass
Proceedings Papers

Effects of Tool Design on Edge Chipping in Ultrasonic-Vibration-Assisted Grinding

Na Qin, Z. J. Pei, W. L. Cong, D. M. Guo
Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 1, 147-154, October 12–15, 2010
Paper No: MSEC2010-34182
DOI: https://doi.org/10.1115/MSEC2010-34182
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Topics: Ceramics, Cutting tools, Design, Finite element analysis, Grinding, Vibration
Proceedings Papers

Ultrasonic-Vibration-Assisted Grinding of Titanium: Cutting Force Modeling With Design of Experiments

Na Qin, Z. J. Pei, D. M. Guo
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2, 619-624, October 4–7, 2009
Paper No: MSEC2009-84325
DOI: https://doi.org/10.1115/MSEC2009-84325
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Topics: Cutting, Design, Experimental design, Grinding, Modeling, Titanium, Vibration
Proceedings Papers

Nanotopography in Silicon Wafer Manufacturing: A Literature Review

Na Qin, Z. J. Pei, D. M. Guo
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 721-728, October 4–7, 2009
Paper No: MSEC2009-84201
DOI: https://doi.org/10.1115/MSEC2009-84201
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Topics: Grinding, Manufacturing, Semiconductor wafers
Journal Articles

Physics-Based Predictive Cutting Force Model in Ultrasonic-Vibration-Assisted Grinding for Titanium Drilling

Na Qin, Z. J. Pei, C. Treadwell, D. M. Guo
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. August 2009, 131(4): 041011.
DOI: https://doi.org/10.1115/1.3159050
Published Online: July 14, 2009
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Topics: Cutting, Diamonds, Vibration, Titanium, Grinding, Drilling, Physics