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Naoki Kimura
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Journal Articles

Simulation of All-Solid-State Lithium-Ion Batteries With Fastening Stress and Volume Expansion

Keita Nunoshita, Ryusei Hirata, Magnus So, Kayoung Park, Xuanchen Liu, Naoki Kimura, Gen Inoue, Yoshifumi Tsuge
Journal: Journal of Electrochemical Energy Conversion and Storage
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2022, 19(2): 021022.
Paper No: JEECS-21-1212
DOI: https://doi.org/10.1115/1.4054015
Published Online: March 17, 2022
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Topics: Active materials, Electrodes, Pressure, Simulation, Anodes, Overvoltage, Lithium-ion batteries, Stress
Journal Articles

Influence of Surface Structure on Performance of Inkjet Printed Cathode Catalyst Layers for Polymer Electrolyte Fuel Cells

Kayoung Park, Yuting Wei, Magnus So, Tae Hyoung Noh, Naoki Kimura, Yoshifumi Tsuge, Gen Inoue
Journal: Journal of Electrochemical Energy Conversion and Storage
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. February 2022, 19(1): 010910.
Paper No: JEECS-21-1140
DOI: https://doi.org/10.1115/1.4052629
Published Online: October 20, 2021
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Topics: Catalysts, Current density, Diffusion (Physics), Electrolytes, Fuel cells, Oxygen, Polymers, Printing, Membrane electrode assemblies, Inks
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Paper No: IPACK2015-48105
DOI: https://doi.org/10.1115/IPACK2015-48105
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

Evaluation of Strength in Joints of Silicon and Sapphire Coating Silicon

Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Paper No: IPACK2013-73113
DOI: https://doi.org/10.1115/IPACK2013-73113
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Topics: Coating processes, Coatings, Sapphire, Silicon, Delamination, Bonding, Resins, Stress, Cooling, Temperature