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1-4 of 4
Naoki Kimura
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Journal Articles
Keita Nunoshita, Ryusei Hirata, Magnus So, Kayoung Park, Xuanchen Liu, Naoki Kimura, Gen Inoue, Yoshifumi Tsuge
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2022, 19(2): 021022.
Paper No: JEECS-21-1212
Published Online: March 17, 2022
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. February 2022, 19(1): 010910.
Paper No: JEECS-21-1140
Published Online: October 20, 2021
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73113