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P. I. Nicholson
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Proceedings Papers

Matrix Crack Networks in SiC/SiC Composites: In-Situ Characterisation and Metrics

S. P. Jordan, S. P. Jeffs, C. D. Newton, L. Gale, P. I. Nicholson, M. R. Bache
Proc. ASME. GT2021, Volume 6: Ceramics and Ceramic Composites; Coal, Biomass, Hydrogen, and Alternative Fuels; Microturbines, Turbochargers, and Small Turbomachines, V006T02A001, June 7–11, 2021
Paper No: GT2021-03796
DOI: https://doi.org/10.1115/GT2021-03796
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Topics: Composite materials, Fracture (Materials), Damage, Temperature, Ceramic matrix composites, Acoustic emissions, Cracking (Materials), Displacement, Engineering inspection, Engineering systems and industry applications
Proceedings Papers

In-Situ Assessment of Fracture in SiC f /SiC Under Computed X-Ray Tomography

M. R. Bache, P. I. Nicholson, E. Williams
Proc. ASME. GT2018, Volume 6: Ceramics; Controls, Diagnostics, and Instrumentation; Education; Manufacturing Materials and Metallurgy, V006T02A005, June 11–15, 2018
Paper No: GT2018-75795
DOI: https://doi.org/10.1115/GT2018-75795
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Topics: Ceramic matrix composites, Computerized tomography, Damage, Failure mechanisms, Fibers, Fracture (Materials), Fracture (Process), Inspection, Mechanical behavior, Scanning electron microscopy
Proceedings Papers

Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental

H. X. Shang, J. X. Gao, P. I. Nicholson
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 153-161, October 31–November 6, 2008
Paper No: IMECE2008-66417
DOI: https://doi.org/10.1115/IMECE2008-66417
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Topics: Ball-Grid-Array packages, Solder joints, Thermal stresses, Ball-Grid-Array packaging, Finite element analysis, Temperature, High temperature, Interferometry, Reliability, Resolution (Optics)