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Peng Su
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041001.
Paper No: EP-20-1010
Published Online: August 27, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Paper No: IPACK2019-6507
Journal Articles
Article Type: Technical Briefs
J. Med. Devices. June 2016, 10(2): 024503.
Paper No: MED-15-1254
Published Online: May 12, 2016
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 411-416, July 19–23, 2009
Paper No: InterPACK2009-89333