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Poornima Mynampati
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Proceedings Papers

Optimization of a Air-Cooled Heatsink for Immersion Cooling Application

Gautam Gupta, Vivek Nair, Sai Abhideep Pundla, Pratik Bansode, Rohit Suthar, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112054
https://doi.org/10.1115/IPACK2023-112054
View Paper titled, Optimization of a Air-Cooled Heatsink for Immersion Cooling Application
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Topics: Cooling, Fluids, Heat sinks, Optimization
Proceedings Papers

A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server

Gautam Gupta, Vivek Nair, Pratik Bansode, Rohit Suthar, Sai Abhideep Pundla, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112065
https://doi.org/10.1115/IPACK2023-112065
View Paper titled, A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server
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Topics: Cooling, Density, Forced convection, Natural convection
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97402
https://doi.org/10.1115/IPACK2022-97402
View Paper titled, CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Thermally Based Design Optimization of Telecommunication Shelter

Venkata Naga Poornima Mynampati, Feroz Ahamed Iqbal Mariam, Bharathkrishnan Muralidharan, Abhilash Ramachandran Menon, Dereje Agonafer, Mark Hendrix
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 421-426, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40949
https://doi.org/10.1115/IMECE2010-40949
View Paper titled, Thermally Based Design Optimization of Telecommunication Shelter
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Topics: Design, Optimization, Telecommunications, Temperature, Computational fluid dynamics, Electronics, Heat, HVAC equipment, Modular construction, Thermal analysis
Proceedings Papers

Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers

Venkata Naga Poornima Mynampati, Saket Karajgikar, Ibraheem Sheerah, Dereje Agonafer, Shlomo Novotny, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 405-410, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40659
https://doi.org/10.1115/IMECE2010-40659
View Paper titled, Rear Door Heat Exchanger Cooling Performance in Telecommunication Data Centers
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Topics: Cooling, Data centers, Doors, Heat exchangers, Telecommunications, Heat, Stress, Density, Energy consumption, Thermal analysis
Proceedings Papers

Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics

Fahad Mirza, Bharathkrishnan Muralidharan, Poornima Mynampati, Saket Karajgikar, Dereje Agonafer
Proc. ASME. IMECE2010, Volume 10: Micro and Nano Systems, 675-680, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40803
https://doi.org/10.1115/IMECE2010-40803
View Paper titled, Coupled Thermal and Structural Parametric Analysis of TSVs in 3D Electronics
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Topics: Electronics, Energy dissipation, Heat, Silicon, Delays, Density, Electronic products, Failure, Insulation, Integrated circuits
Proceedings Papers

CFD Modeling of Environmental System Options Used for Cooling of Telecommunication Shelters

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Abhilash Ramachandran Menon, Venkata Naga Poornima Mynampati, Dereje Agonafer, Mark Hendrix
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 733-740, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23280
https://doi.org/10.1115/IHTC14-23280
View Paper titled, CFD Modeling of Environmental System Options Used for Cooling of Telecommunication Shelters
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Topics: Computational fluid dynamics, Cooling, Modeling, Telecommunications, Design, Heating, Temperature, Air conditioners, Carbon, Cooling systems
Proceedings Papers

Review of Reliability of the Cooling Technologies in the Telecommunications Systems

Venkata Naga Poornima Mynampati, Feroz Ahamed Iqbal Mariam, Bharath Krishnan Muralidharan, Dereje Agonafer
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1457-1462, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-13016
https://doi.org/10.1115/IMECE2009-13016
View Paper titled, Review of Reliability of the Cooling Technologies in the Telecommunications Systems
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Topics: Cooling, Reliability, Telecommunications