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Pratik Vithoba Bansode
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Proceedings Papers

Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling

Vibin Shalom Simon, Geevarghese Joseph, Anto Barigala, Satyam Saini, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112010
https://doi.org/10.1115/IPACK2023-112010
View Paper titled, Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling
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Topics: Cooling, Pareto optimization
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97423
https://doi.org/10.1115/IPACK2022-97423
View Paper titled, Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate
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Topics: Cooling, Thermomechanics
Proceedings Papers

CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid

Amirreza Niazmand, Tushar Chauhan, Satyam Saini, Pardeep Shahi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2595
https://doi.org/10.1115/IPACK2020-2595
View Paper titled, CFD Simulation of Two-Phase Immersion Cooling Using FC-72 Dielectric Fluid
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Topics: Computational fluid dynamics, Cooling, Electronics, Fluids, Simulation