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Proc. ASME. IMECE2006, Engineering Technology Management: Engineering Business Management, Safety Engineering and Risk Analysis, Technology and Society, 189-195, November 5–10, 2006

Paper No: IMECE2006-14790

DOI: https://doi.org/10.1115/IMECE2006-14790

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Topics: Nanotechnology

Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan

J. Electron. Packag. September 2006, 128(3): 259–266.

DOI: https://doi.org/10.1115/1.2229225

Published Online: September 23, 2005

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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials

Journal Articles

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma

J. Electron. Packag. December 2002, 124(4): 391–396.

DOI: https://doi.org/10.1115/1.1510864

Published Online: December 12, 2002

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Topics: Epoxy adhesives, Epoxy resins, Hardening (Curing), Heating, Heat transfer coefficients, Temperature

Journal Articles

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

A. Bhattacharya, Research Assistant, R. L. Mahajan, Professor

J. Electron. Packag. September 2002, 124(3): 155–163.

DOI: https://doi.org/10.1115/1.1464877

Published Online: July 26, 2002

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Topics: Fins, Flow (Dynamics), Heat sinks, Heat transfer coefficients, Metal foams, Forced convection, Heat transfer

Journal Articles

Forced Convection in High Porosity Metal Foams

V. V. Calmidi, R. L. Mahajan

J. Heat Transfer. August 2000, 122(3): 557–565.

DOI: https://doi.org/10.1115/1.1287793

Published Online: February 14, 2000

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Topics: Aluminum, Fluids, Forced convection, Heat transfer, Metal foams, Porosity, Thermal conductivity, Porous materials, Flow (Dynamics), Temperature

Journal Articles

Alternative Curing Methods for FCOB Underfill

M. M. Merton, C. P. Malhotra, N. Nikmanesh, R. L. Mahajan

J. Electron. Packag. December 1999, 121(4): 249–254.

DOI: https://doi.org/10.1115/1.2793848

Published Online: December 1, 1999

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Topics: Hardening (Curing), Condensation, Failure mechanisms, Heat transfer, Vapors, Delamination, Failure, Fatigue failure, Flip-chip, Heating

Journal Articles

Mixed Convection in a Horizontal Porous Duct With a Sudden Expansion and Local Heating From Below

Y. Yokoyama, F. A. Kulacki, R. L. Mahajan

J. Heat Transfer. August 1999, 121(3): 653–661.

DOI: https://doi.org/10.1115/1.2826029

Published Online: August 1, 1999

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Topics: Ducts, Heat transfer, Heating, Mixed convection, Glass, Heat, Heat exchangers, Water, Convection, Forced convection

Journal Articles

The Effective Thermal Conductivity of High Porosity Fibrous Metal Foams

V. V. Calmidi, R. L. Mahajan

J. Heat Transfer. May 1999, 121(2): 466–471.

DOI: https://doi.org/10.1115/1.2826001

Published Online: May 1, 1999

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Topics: Heat conduction, Metal foams, Porosity, Porous materials, Thermal conductivity

Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

J. Electron. Packag. June 1998, 120(2): 118–122.

DOI: https://doi.org/10.1115/1.2792592

Published Online: June 1, 1998

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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation

Journal Articles

Analysis of Tombstoning Phenomenon During Reflow

Q. Qi, R. L. Mahajan

J. Electron. Packag. March 1998, 120(1): 61–67.

DOI: https://doi.org/10.1115/1.2792287

Published Online: March 1, 1998

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Topics: Algebra, Dynamic models, Equations of motion, Geometry, Gravity (Force), Solders

Journal Articles

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan

J. Electron. Packag. March 1998, 120(1): 54–60.

DOI: https://doi.org/10.1115/1.2792286

Published Online: March 1, 1998

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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design

Journal Articles

Maximizing Solder Joint Reliability Through Optimal Shape Design

A. M. Deshpande, G. Subbarayan, R. L. Mahajan

J. Electron. Packag. September 1997, 119(3): 149–155.

DOI: https://doi.org/10.1115/1.2792227

Published Online: September 1, 1997

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Topics: Reliability, Shape optimization, Solder joints, Optimization, Approximation, Design, Electronic packages, Fatigue life, Artificial neural networks, Ball-Grid-Array packaging

Journal Articles

Real-Time Physiconeural Solutions for MOCVD

A. S. Kelkar, R. L. Mahajan, R. L. Sani

J. Heat Transfer. November 1996, 118(4): 814–821.

DOI: https://doi.org/10.1115/1.2822575

Published Online: November 1, 1996

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Topics: Metalorganic chemical vapor deposition, Artificial neural networks, Optimization, Computer software, Engineering simulation, Experimental design, Fluid dynamics, Manufacturing, Materials processing, Mixed convection

Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan

J. Electron. Packag. September 1996, 118(3): 148–156.

DOI: https://doi.org/10.1115/1.2792145

Published Online: September 1, 1996

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Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages

Journal citation

NARROW

CBGA Solder Fillet Shape Prediction and Design Optimization

Mechanically Aspirated Solar Radiation Shields: A CFD and Neural Network Design Analysis

Strategies for Building Artificial Neural Network Models

Applications of Artificial Neural Network Analysis in Thermal Systems

Transient Thermal Modeling of Pulsed Laser Irradiation of a Low Absorbing Multilayer Device Using a 2D Model

Enhancing the Power Handling Capacity of Micro Mirrors: An Experimental and Numerical Investigation

Midstream Modulation of Nanotechnology in an Academic Research Laboratory

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

An Analytical Cure Model for Underfill Epoxies

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

Forced Convection in High Porosity Metal Foams

Alternative Curing Methods for FCOB Underfill

Mixed Convection in a Horizontal Porous Duct With a Sudden Expansion and Local Heating From Below

The Effective Thermal Conductivity of High Porosity Fibrous Metal Foams

CBGA Solder Fillet Shape Prediction and Design Optimization

Analysis of Tombstoning Phenomenon During Reflow

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Maximizing Solder Joint Reliability Through Optimal Shape Design

Real-Time Physiconeural Solutions for MOCVD

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

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