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Proceedings Papers
Proc. ASME. IMECE98, Safety Engineering and Risk Analysis, 57-60, November 15–20, 1998
Paper No: IMECE1998-0340
Proceedings Papers
Proc. ASME. IMECE2001, Adaptive Structures and Material Systems, 367-372, November 11–16, 2001
Paper No: IMECE2001/AD-23743
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 277-283, November 5–10, 2000
Paper No: IMECE2000-2274
Journal Articles
Journal:
Journal of Applied Mechanics
Article Type: Technical Briefs
J. Appl. Mech. December 1959, 26(4): 681–682.
Published Online: June 23, 2021
Topics:
Springs
Journal Articles
Journal:
Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. December 1958, 25(4): 449–452.
Published Online: June 16, 2021
Proceedings Papers
Proc. ASME. SMASIS2018, Volume 1: Development and Characterization of Multifunctional Materials; Modeling, Simulation, and Control of Adaptive Systems; Integrated System Design and Implementation, V001T03A006, September 10–12, 2018
Paper No: SMASIS2018-7978
Journal Articles
Tahany I. El-Wardany, Ying She, Vijay N. Jagdale, Jacquelynn K. Garofano, Joe J. Liou, Wayde R. Schmidt
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
Published Online: May 9, 2018
Proceedings Papers
Alan S. Feitelberg, Michael D. Starkey, Richard B. Schiefer, Roointon E. Pavri, Matt Bender, John L. Booth, Gordon R. Schmidt
Proc. ASME. GT1999, Volume 2: Coal, Biomass and Alternative Fuels; Combustion and Fuels; Oil and Gas Applications; Cycle Innovations, V002T02A010, June 7–10, 1999
Paper No: 99-GT-058
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031005.
Paper No: EP-13-1107
Published Online: May 5, 2014
Proceedings Papers
Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A022, July 16–18, 2013
Paper No: IPACK2013-73268
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A023, July 16–18, 2013
Paper No: IPACK2013-73281
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A024, July 16–18, 2013
Paper No: IPACK2013-73282
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030901.
Paper No: EP-12-1089
Published Online: July 24, 2013
Proceedings Papers
James F. Smith, Waleed A. Abdelmaksoud, Hamza S. Erden, John F. Dannenhoffer, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 415-422, July 6–8, 2011
Paper No: IPACK2011-52016
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 451-459, July 6–8, 2011
Paper No: IPACK2011-52067
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 915-921, July 19–23, 2009
Paper No: InterPACK2009-89258
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 877-886, July 8–12, 2007
Paper No: IPACK2007-33924
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 819-826, July 8–12, 2007
Paper No: IPACK2007-33508
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 401-408, July 17–22, 2005
Paper No: IPACK2005-73273
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 493-501, July 17–22, 2005
Paper No: IPACK2005-73375