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Proceedings Papers

Advances in Air-Cooled Heat Exchanger Technology

Ralph L. Webb

Proc. ASME. IMECE2000, Advances in Enhanced Heat Transfer, 49-57, November 5–10, 2000

Paper No: IMECE2000-1278

DOI: https://doi.org/10.1115/IMECE2000-1278

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Topics: Heat exchangers, Air conditioning, Condensers (steam plant), Coolers

Proceedings Papers

Advanced Technology for Server Cooling

Ralph L. Webb, Hasan Nasir

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 365-372, July 17–22, 2005

Paper No: IPACK2005-73262

DOI: https://doi.org/10.1115/IPACK2005-73262

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Topics: Cooling, Heat exchangers, Microchannels

Proceedings Papers

Odyssey of the Enhanced Boiling Surface

Ralph L. Webb

Proc. ASME. HT-FED2004, Volume 4, 961-969, July 11–15, 2004

Paper No: HT-FED2004-56918

DOI: https://doi.org/10.1115/HT-FED2004-56918

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Topics: Boiling, Geometry, Patents, Tunnels, Evaporation, Flow visualization, Industrial research

Proceedings Papers

Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks

Ralph L. Webb, Jin Wook Paek

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 699-704, July 6–11, 2003

Paper No: IPACK2003-35354

DOI: https://doi.org/10.1115/IPACK2003-35354

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Topics: Flow (Dynamics), Heat sinks, Pressure drop, Ducts, Errors, Heat exchangers, Plates (structures)

Proceedings Papers

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

Ralph L. Webb

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 527-535, July 6–11, 2003

Paper No: IPACK2003-35251

DOI: https://doi.org/10.1115/IPACK2003-35251

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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Friction, Manufacturing, Microelectromechanical systems, Cooling, Reynolds number, Shapes

Proceedings Papers

Very High Performance Thermal Interface Material and Attachment Technology

Ralph L. Webb, Jin Wook Paek, David Pickrell

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 537-543, July 6–11, 2003

Paper No: IPACK2003-35253

DOI: https://doi.org/10.1115/IPACK2003-35253

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Topics: Alloys, Contact resistance, Contamination, Copper, Diffusion (Physics), Errors, Melting, Melting point, Modeling, Oxidation

Proceedings Papers

Thermal Performance Analysis of Fan-Heat Sinks for CPU Cooling

Seo Young Kim, Ralph L. Webb

Proc. ASME. IMECE2003, Heat Transfer, Volume 2, 235-243, November 15–21, 2003

Paper No: IMECE2003-42172

DOI: https://doi.org/10.1115/IMECE2003-42172

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Topics: Computer cooling, Ducts, Flow (Dynamics), Friction, Heat, Heat sinks, Pressure drop, Strips, Temperature, Thermal resistance

Proceedings Papers

Next Generation Devices for Electronic Cooling

Ralph L. Webb

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 583-591, November 15–21, 2003

Paper No: IMECE2003-42179

DOI: https://doi.org/10.1115/IMECE2003-42179

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Topics: Computer cooling, Computers, Fluids, Heat, Heat sinks

Journal Articles

Heat Exchanger Design Methodology for Electronic Heat Sinks

Ralph L. Webb

J. Heat Transfer. July 2007, 129(7): 899–901.

DOI: https://doi.org/10.1115/1.2717249

Published Online: October 12, 2006

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Topics: Design methodology, Heat exchangers, Heat sinks, Temperature, Heat transfer

Journal Articles

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

Ralph L. Webb

J. Heat Transfer. January 2005, 127(1): 2–10.

DOI: https://doi.org/10.1115/1.1800512

Published Online: February 15, 2005

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Topics: Cooling, Fluids, Heat, Heat sinks, Design, Forced convection, Microchannels, Water

Journal Articles

Donald Q. Kern Lecture Award Paper: Odyssey of the Enhanced Boiling Surface

Ralph L. Webb

J. Heat Transfer. December 2004, 126(6): 1051–1059.

DOI: https://doi.org/10.1115/1.1834615

Published Online: January 26, 2005

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Topics: Boiling, Tunnels, Evaporation, Bubbles

Journal Articles

Closure to "Discussion: 'Commentary on Correlations for Convective Vaporization in Tubes,' (Webb, Ralph. L., 2003, ASME J. of Heat Transfer, 125 (1), pp. 184–185.)'

Ralph L. Webb

J. Heat Transfer. December 2003, 125(6): 1208.

DOI: https://doi.org/10.1115/1.1621896

Published Online: November 19, 2003

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Topics: Boiling, Convection, Heat transfer, Pipe flow, Two-phase flow, Nucleate boiling, Heat flux

Journal Articles

Commentary on Correlations for Convective Vaporization in Tubes

Ralph L. Webb

J. Heat Transfer. February 2003, 125(1): 184–185.

DOI: https://doi.org/10.1115/1.1527902

Published Online: January 29, 2003

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Topics: Boiling, Convection, Flow (Dynamics), Forced convection, Heat flux, Nucleate boiling, Nucleate pool boiling, Pipe flow

Journal Articles

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

Koichiro Take, Ralph L. Webb

J. Electron. Packag. September 2001, 123(3): 189–195.

DOI: https://doi.org/10.1115/1.1348010

Published Online: April 1, 2000

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Topics: Flat heat pipes, Heat, Heat pipes, Thermal resistance, Temperature, Laptop computers

Journal Articles

A Generalized Procedure for the Design and Optimization of Fluted Gregorig Condensing Surfaces

Ralph L. Webb

J. Heat Transfer. May 1979, 101(2): 335–339.

DOI: https://doi.org/10.1115/1.3450970

Published Online: May 1, 1979

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Topics: Design, Optimization, Geometry, Shapes, Condensers (steam plant), Construction

Journal citation

NARROW

Advances in Air-Cooled Heat Exchanger Technology

Advanced Technology for Server Cooling

Odyssey of the Enhanced Boiling Surface

Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

Very High Performance Thermal Interface Material and Attachment Technology

Thermal Performance Analysis of Fan-Heat Sinks for CPU Cooling

Next Generation Devices for Electronic Cooling

Heat Exchanger Design Methodology for Electronic Heat Sinks

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

Donald Q. Kern Lecture Award Paper: Odyssey of the Enhanced Boiling Surface

Closure to "Discussion: 'Commentary on Correlations for Convective Vaporization in Tubes,' (Webb, Ralph. L., 2003, ASME J. of Heat Transfer, 125 (1), pp. 184–185.)'

Commentary on Correlations for Convective Vaporization in Tubes

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

A Generalized Procedure for the Design and Optimization of Fluted Gregorig Condensing Surfaces

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