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Ram Ranjan
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041001.
Paper No: EP-13-1073
Published Online: September 19, 2014
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73073
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 69-80, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52039
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 131-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52041
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2011, 133(8): 080911.
Published Online: April 28, 2011
Proceedings Papers
Numerical Study of Evaporation Heat Transfer From the Liquid-Vapor Interface in Wick Microstructures
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1323-1333, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11326
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2010, 132(8): 080902.
Published Online: June 11, 2010
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2009, 131(10): 101001.
Published Online: July 28, 2009
Proceedings Papers
Proc. ASME. HT2008, Heat Transfer: Volume 2, 789-798, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56170