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Proceedings Papers
Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6572
Proceedings Papers
Pradeep Lall, Aathi Raja Ram Pandurangan, Venkata Kalyan Reddy Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6575
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041013.
Paper No: EP-14-1004
Published Online: September 19, 2014
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73252
Proceedings Papers
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 775-785, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-93058
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 973-986, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65832
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021001.
Published Online: June 11, 2012
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 549-562, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52197
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 903-914, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89308
Proceedings Papers
Prognostication Based on Resistance-Spectroscopy for High Reliability Electronics Under Shock-Impact
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 383-394, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-13351