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S. K. W. Seah
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Proceedings Papers

Understanding and Testing for Drop Impact Failure

S. K. W. Seah, E. H. Wong, R. Ranjan, C. T. Lim, Y.-W. Mai
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1089-1094, July 17–22, 2005
Paper No: IPACK2005-73047
DOI: https://doi.org/10.1115/IPACK2005-73047
View Paper titled, Understanding and Testing for Drop Impact Failure
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Topics: Failure, Testing, Inertia (Mechanics), Solder joints, Ball-Grid-Array packages, Electronics, Impact testing, Printed circuit boards, Shock (Mechanics), Stress
Proceedings Papers

Tackling the Drop Impact Reliability of Electronic Packaging

E. H. Wong, C. T. Lim, J. E. Field, V. B. C. Tan, V. P. W. Shim, K. M. Lim, S. K. W. Seah
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 757-763, July 6–11, 2003
Paper No: IPACK2003-35101
DOI: https://doi.org/10.1115/IPACK2003-35101
View Paper titled, Tackling the Drop Impact Reliability of Electronic Packaging
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Topics: Alloys, Collaboration, Design, Electronic packaging, Failure, Impact strength, Impact testing, Lead-free solders, Microelectronic devices, Physics
Journal Articles

Board Level Drop Impact—Fundamental and Parametric Analysis

E. H. Wong, Y-W Mai, S. K. W. Seah
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
DOI: https://doi.org/10.1115/1.2065747
Published Online: March 30, 2005
View Article titled, Board Level Drop Impact—Fundamental and Parametric Analysis
Click here to open pdf in another window PDF for Board Level Drop Impact—Fundamental and Parametric Analysis
Topics: Stress, Dynamics (Mechanics), Springs, Manufacturing