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1-9 of 9
S. Ravi Annapragada
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. May 2020, 17(2): 021107.
Paper No: JEECS-19-1103
Published Online: March 3, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
Proceedings Papers
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A090, November 15–21, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2013-66318
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 655-666, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65370
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 693-701, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52061
Proceedings Papers
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 925-934, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88365
Proceedings Papers
Proc. ASME. HT2008, Heat Transfer: Volume 1, 475-484, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56375
Proceedings Papers
Proc. ASME. IMECE2005, Heat Transfer, Part B, 925-933, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80432
Proceedings Papers
Proc. ASME. IMECE2006, Heat Transfer, Volume 2, 593-602, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14720