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Santosh Sankarasubramanian
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Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
https://doi.org/10.1115/1.4036356
Published Online: April 24, 2017
View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives
Proceedings Papers

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Edvin Cetegen, David McCoy, Pramod Malatkar
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A047, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67007
https://doi.org/10.1115/IMECE2016-67007
View Paper titled, High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Open the PDF for High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method in another window
Topics: Adhesion, Cantilever beams, Electronic packaging, High temperature, Temperature, Adhesives, Testing, Manufacturing, Accelerated life testing, Failure mechanisms