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Sevket U. Yuruker
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Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
DOI: https://doi.org/10.1115/1.4051999
Published Online: September 8, 2021
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Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management
Proceedings Papers

Advanced Packaging and Thermal Management of High-Power DC-DC Converters

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
DOI: https://doi.org/10.1115/IPACK2019-6559
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Topics: Electronics, Packaging, Packaging density (Electronics), Thermal management