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Sumitomo Hidaka
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Journal Articles

Limited Enhancement of Subatmospheric Boiling on Treated Structured Surfaces With Biphilic Pattern

Biao Shen, Naoki Iwata, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. October 2021, 143(10): 101601.
Paper No: HT-21-1130
DOI: https://doi.org/10.1115/1.4051056
Published Online: September 8, 2021
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Topics: Boiling, Bubbles, Cavities, Heat transfer, Pressure, Nucleate boiling, Vapors, Nucleation (Physics), Dynamics (Mechanics)
Includes: Supplementary data
Proceedings Papers

A Loop Thermosyphon With Hydrophobic Spots Evaporator Surface

Hongbin He, Biao Shen, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata
Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A002, June 10–13, 2018
Paper No: ICNMM2018-7623
DOI: https://doi.org/10.1115/ICNMM2018-7623
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Topics: Boiling, Bubbles, Coating processes, Coatings, Cooling, Copper, Density, Electroplating, Fluids, Heat
Proceedings Papers

A Photographic Study on the Effects of Hydrophobic-Spot Size and Subcooling on Local Film Boiling

Bambang Joko Suroto, Masahiro Tashiro, Sana Hirabayashi, Sumitomo Hidaka, Masamichi Kohno, Koji Takahashi, Yasuyuki Takata
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A007, June 16–19, 2013
Paper No: ICNMM2013-73069
DOI: https://doi.org/10.1115/ICNMM2013-73069
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Topics: Film boiling, Photography, Subcooling, Bubbles, Copper, Heat flux, Boiling, Domes (Structural elements), Dynamics (Mechanics), Fluids
Proceedings Papers

Micro Oscillation Heat Pipe Fabricated on Silicon Wafer

Masamichi Kohno, Takashi Nishizono, Yasunori Onaka, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1343-1346, June 23–25, 2008
Paper No: ICNMM2008-62082
DOI: https://doi.org/10.1115/ICNMM2008-62082
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Topics: Heat pipes, Oscillations, Semiconductor wafers, Flow (Dynamics), Fluids, Heat, Heat transfer, Microchannels, Pulsatile flow, Vibration