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Journal Articles

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Kyle Yazzie, Tsgereda Alazar, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020912.
Paper No: EP-17-1010
https://doi.org/10.1115/1.4036661
Published Online: June 12, 2017
View Article titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
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Topics: Failure, Fracture (Materials), Fracture toughness, Solder masks, Stress, Thin films, Membranes, Fracture (Process), Electronic packaging, Testing
Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
https://doi.org/10.1115/1.4036356
Published Online: April 24, 2017
View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives
Proceedings Papers

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Vijay Subramanian, Tsgereda Alazar, Kyle Yazzie, Bharat Penmecha, Pilin Liu, Yiqun Bai, Pramod Malatkar
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A048, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-67145
https://doi.org/10.1115/IMECE2016-67145
View Paper titled, Characterization of Bulk and Thin Film Fracture in Electronic Packaging
Open the PDF for Characterization of Bulk and Thin Film Fracture in Electronic Packaging in another window
Topics: Electronic packaging, Fracture (Materials), Thin films, Fracture toughness, Packaging, Epoxy resins, Testing, Blades, Dimensions, Failure
Proceedings Papers

On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques

Sandeep Sane, Shalabh Tandon, Biju Chandran, Tsgereda Alazar, Leonard R. Sorenson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 965-969, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73306
https://doi.org/10.1115/IPACK2005-73306
View Paper titled, On Measurement of Effective Silicon Backend Strength Using Bump Pull/Shear Techniques
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Topics: Shear (Mechanics), Silicon, Manufacturing, Failure mechanisms, Stress, Failure, Reliability, Calibration, Delays, Failure analysis