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Valeriy Sukharev
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Journal Articles

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Mark Nakamoto, Wei Zhao, Riko Radojcic, Uwe Muehle, Ehrenfried Zschech
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
https://doi.org/10.1115/1.4036402
Published Online: June 12, 2017
View Article titled, Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip-Package Interaction
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Topics: Simulation, Stress, Transistors, Flow (Dynamics), Design, Silicon
Proceedings Papers

CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, Henrik Hovsepyan, Uwe Muehle, Ehrenfried Zschech, Riko Radojcic
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A046, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65171
https://doi.org/10.1115/IMECE2016-65171
View Paper titled, CPI Stress Induced Carrier Mobility Shift in Advanced Silicon Nodes
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Topics: Electron mobility, Silicon, Stress, Simulation, Design, Flow (Dynamics), Calibration, Circuits, Finite element analysis, Fittings
Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031002.
Paper No: EP-13-1037
https://doi.org/10.1115/1.4029835
Published Online: September 1, 2015
View Article titled, Multiscale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution
Proceedings Papers

Multi-Scale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 767-774, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89864
https://doi.org/10.1115/IMECE2012-89864
View Paper titled, Multi-Scale Transient Thermal Analysis of Microelectronics
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Topics: Microelectronic devices, Thermal analysis, Transients (Dynamics), Arches, Ball-Grid-Array packaging, Energy efficiency, Finite element analysis, Finite element model, Flip-chip, Flip-chip devices