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Proceedings Papers

A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling

Satyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
https://doi.org/10.1115/IPACK2023-112005
View Paper titled, A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
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Topics: Cooling, Data centers, Heat sinks, Heat transfer, Mixed convection, Thermal management
Proceedings Papers

Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling

Vibin Shalom Simon, Geevarghese Joseph, Anto Barigala, Satyam Saini, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112010
https://doi.org/10.1115/IPACK2023-112010
View Paper titled, Parametric Multi-Objective Optimization of Cold Plate for Single-Phase Immersion Cooling
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Topics: Cooling, Pareto optimization
Proceedings Papers

Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution

Vibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
https://doi.org/10.1115/IPACK2023-112078
View Paper titled, Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
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Topics: Cooling, Data centers, Doors, Heat exchangers
Proceedings Papers

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Mohan Sai Ramalingam, Rohit Suthar, Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Gautam Gupta, Vibin Shalom Simon, Himanshu Modi, Vivek Nair, Krishna Bhavana Sivaraju, Pardeep Shahi, Satyam Saini, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111056
https://doi.org/10.1115/IPACK2023-111056
View Paper titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Thermomechanics
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
https://doi.org/10.1115/IPACK2022-97494
View Paper titled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97445
https://doi.org/10.1115/IPACK2022-97445
View Paper titled, CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server
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Topics: Computational fluid dynamics, Cooling, Heat