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Vish Prasad
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Journal Articles

Unified, Integral Approach to Modeling and Design of High-Pressure Pipelines: Assessment of Various Flow and Temperature Models for Supercritical Fluids

Guo-Xiang Wang, Vish Prasad
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research-Article
J. Fluids Eng. February 2025, 147(2): 021402.
Paper No: FE-24-1298
https://doi.org/10.1115/1.4066483
Published Online: September 30, 2024
View Article titled, Unified, Integral Approach to Modeling and Design of High-Pressure Pipelines: Assessment of Various Flow and Temperature Models for Supercritical Fluids
Open the PDF for Unified, Integral Approach to Modeling and Design of High-Pressure Pipelines: Assessment of Various Flow and Temperature Models for Supercritical Fluids in another window
Topics: Flow (Dynamics), Fluids, Pipelines, Pipes, Pressure, Temperature
Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1121
https://doi.org/10.1115/IMECE1997-1121
View Paper titled, Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
Open the PDF for Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production in another window
Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw

Mohan Chandra, Philippe Leyvraz, Jon A. Talbott, Kedar P. Gupta, Imin Kao, Vish Prasad
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 807-811, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1095
https://doi.org/10.1115/IMECE1998-1095
View Paper titled, Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw
Open the PDF for Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw in another window
Topics: Semiconductor wafers, Slurries, Cutting, Wire, Silicon, Finishes, Particulate matter