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Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Paper No: IPACK2015-48088
Journal: Journal of Applied Mechanics
Article Type: Research Papers
J. Appl. Mech. December 1982, 49(4): 885–894.
Published Online: December 1, 1982