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William W. F. Chong
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Proceedings Papers

Simulating Surface Forces Between Iron Oxide Surfaces Immersed in Methyl Oleate Using Molecular Dynamics

William W. F. Chong, Hedong Zhang
Proc. ASME. ISPS-MIPE2018, ASME-JSME 2018 Joint International Conference on Information Storage and Processing Systems and Micromechatronics for Information and Precision Equipment, V001T09A005, August 29–30, 2018
Paper No: ISPS-MIPE2018-8524
DOI: https://doi.org/10.1115/ISPS-MIPE2018-8524
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Topics: Iron, Molecular dynamics, Stress, Simulation, Separation (Technology), Bearings, Crystal structure, Density, Molecular dynamics simulation, Simulation models
Proceedings Papers

Semi-Analytic Iterative Solution for the Adhesive Contact Between a Micro-Indenter and a Graded Elasticity Coating

Stewart J. Chidlow, William W. F. Chong, Mircea Teodorescu
Proc. ASME. IDETC-CIE2014, Volume 4: 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems, V004T09A026, August 17–20, 2014
Paper No: DETC2014-35110
DOI: https://doi.org/10.1115/DETC2014-35110
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Topics: Adhesives, Coating processes, Coatings, Elasticity, Stress, Algorithms, Boundary-value problems, Fourier transforms, Integral equations, Pressure
Proceedings Papers

Rupture and Reformation of Ultra-Thin Surface Films

William W. F. Chong, Mircea Teodorescu, Homer Rahnejat
Proc. ASME. IDETC-CIE2010, Volume 4: 12th International Conference on Advanced Vehicle and Tire Technologies; 4th International Conference on Micro- and Nanosystems, 401-407, August 15–18, 2010
Paper No: DETC2010-28427
DOI: https://doi.org/10.1115/DETC2010-28427
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Topics: Rupture, Thin films, Lubricants, Disks, Cavitation, Data storage systems, Density, Drainage, Film thickness, Flow (Dynamics)