1-20 of 26
Xiaobing Luo
Close
Sort by
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8315
Journal Articles
Journal Articles
Journal Articles
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A044, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48023
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48032